Abstract: A specific polyamide polymer which is obtainable by two specific processes according to the invention. The invention further relates to the use of this polyamide polymer as a functional additive and to detergent compositions, cosmetic compositions, cleaning compositions and adhesive compositions including this polyamide polymer.

Abstract: A specific polyamide polymer which is obtainable by two specific processes according to the invention. The invention further relates to the use of this polyamide polymer as a functional additive and to detergent compositions, cosmetic compositions, cleaning compositions and adhesive compositions including this polyamide polymer.

Abstract: A thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185° C., and at least one liquid polysiloxane compound which preferably has a viscosity of 750 to 100,000 mPas at 25° C. and is OH terminated, wherein the thermoplastic composition is obtainable by a process comprising the steps: 1a) heating the at least one polyamide to a temperature above the melting point of the at least one polyamide and preferably below 185° C.; 2a) adding under stirring the at least one liquid polysiloxane compound to the heated compound(s) of step 1a), wherein the temperature is kept above the melting point of the at least one polyamide and preferably below 185° C.; and 3a) mixing the obtained mixture of step 2a) preferably at 80° to 180° C., more preferably 110 to 140° C. Use of this the thermoplastic composition according to the present invention in sealants, adhesives, or as rheological modifier or surface modifier.

Abstract: A thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185° C., and at least one liquid polysiloxane compound which preferably has a viscosity of 750 to 100,000 mPas at 25° C. and is OH terminated, wherein the thermoplastic composition is obtainable by a process comprising the steps: 1a) heating the at least one polyamide to a temperature above the melting point of the at least one polyamide and preferably below 185° C.; 2a) adding under stirring the at least one liquid polysiloxane compound to the heated compound(s) of step 1a), wherein the temperature is kept above the melting point of the at least one polyamide and preferably below 185° C.; and 3a) mixing the obtained mixture of step 2a) preferably at 80° to 180° C., more preferably 110 to 140° C. Use of this the thermoplastic composition according to the present invention in sealants, adhesives, or as rheological modifier or surface modifier.