Abstract: A method for confining plasma within a plasma processing chamber while processing a substrate is provided. The method includes igniting the plasma within a plasma generating area, wherein the plasma generating area is surrounded by a set of confinement rings. The method also includes providing a chamber wall outside of the set of confinement rings. The method further includes providing a dielectric liner electrode arrangement positioned between the chamber wall and the set of confinement rings, wherein the dielectric liner electrode arrangement having an electrode encapsulated within a dielectric liner, the dielectric liner electrode arrangement being coupled with the chamber wall to create a modified chamber wall. The method yet also includes providing a parallel LC circuit arrangement, the parallel LC circuit arrangement being coupled between the dielectric liner electrode arrangement and the chamber wall.

Abstract: An inductive plasma applicator comprises a ferromagnetic inductively coupled source and an electrode with a hole pattern centered with respect to the plasma source. Such plasma applicator provides an efficient energy transfer to the plasma. The plasma applicator is preferably manufactured using a technology for producing electrical circuits. The electrode and a coil of the ferromagnetic inductively coupled plasma source are metal track portions formed on an insulating substrate. For example, the plasma applicator is manufactured using printed circuit board technology.

Abstract: A method for confining plasma within a plasma processing chamber while processing a substrate is provided. The method includes igniting the plasma within a plasma generating area, wherein the plasma generating area is surrounded by a set of confinement rings. The method also includes providing a chamber wall outside of the set of confinement rings. The method further includes providing a dielectric liner electrode arrangement positioned between the chamber wall and the set of confinement rings, wherein the dielectric liner electrode arrangement having an electrode encapsulated within a dielectric liner, the dielectric liner electrode arrangement being coupled with the chamber wall to create a modified chamber wall. The method yet also includes providing a parallel LC circuit arrangement, the parallel LC circuit arrangement being coupled between the dielectric liner electrode arrangement and the chamber wall.

Abstract: An inductive plasma applicator comprises a ferromagnetic inductively coupled source and an electrode with a hole pattern centred with respect to the plasma source. Such plasma applicator provides an efficient energy transfer to the plasma. The plasma applicator is preferably manufactured using a technology for producing electrical circuits. The electrode and a coil of the ferromagnetic inductively coupled plasma source are metal track portions formed on an insulating substrate. For example, the plasma applicator is manufactured using printed circuit board technology.

Abstract: A method for processing a substrate in a plasma processing chamber having a chamber wall is provided. The method includes providing an electrode arrangement having a cylindrical electrode encapsulated within a dielectric liner, which is coupled with the chamber wall. The method also includes providing an inductive circuit arrangement, which is coupled between the cylindrical electrode and the chamber wall. The method further includes generating a plasma within the plasma processing chamber to process the substrate while the electrode arrangement is disposed within the plasma processing chamber.

Abstract: A probe for measuring electrical characteristics of an excitation current of a plasma is provided. The probe is mounted on a conductive line that includes an inner conductor and an outer conductor. The probe includes a current sensor and a voltage sensor. The current sensor includes a groove formed in the ground of one of the conductors in order to form a detour for the current flowing through the conductor, and a point for measuring electric voltage between a ground connected to the conductor and a point of the groove. The current sensor thus is able to measure a voltage proportional to the first time derivative of intensity (Iplasma) of the excitation current. The voltage sensor is a shunt sensor capable of measuring a voltage proportional to the first time derivative of the voltage (Vplasma) of the excitation current. A plasma reactor including a probe of the aforementioned type is also provided.

Abstract: A probe for measuring electrical characteristics of an excitation current of a plasma is provided. The probe is mounted on a conductive line that includes an inner conductor and an outer conductor. The probe includes a current sensor and a voltage sensor. The current sensor includes a grove formed in the ground of one of the conductors in order to form a detour for the current flowing through the conductor, and a point for measuring electric voltage between a ground connected to the conductor and a point of the groove. The current sensor thus is able to measure a voltage proportional to the first time derivative of intensity (Iplasma) of the excitation current. The voltage sensor is a shunt sensor capable of measuring a voltage proportional to the first time derivative of the voltage (Vplasma) of the excitation current. A plasma reactor including a probe of the aforementioned type is also provided.