Patents by Inventor Sebastien Egret

Sebastien Egret has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transforming metrology data from a semiconductor treatment system using multivariate analysis
    Patent number: 8346506
    Abstract: Metrology data from a semiconductor treatment system is transformed using multivariate analysis. In particular, a set of metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. One or more essential variables for the obtained set of metrology data is determined using multivariate analysis. A first metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. The first obtained metrology data is not one of the metrology data in the set of metrology data earlier obtained. The first metrology data is transformed into a second metrology data using the one or more of the determined essential variables.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: January 1, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Vi Vuong, Junwei Bao, Yan Chen, Heiko Weichert, Sebastien Egret
  • TRANSFORMING METROLOGY DATA FROM A SEMICONDUCTOR TREATMENT SYSTEM USING MULTIVARIATE ANALYSIS
    Publication number: 20120199287
    Abstract: Metrology data from a semiconductor treatment system is transformed using multivariate analysis. In particular, a set of metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. One or more essential variables for the obtained set of metrology data is determined using multivariate analysis. A first metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. The first obtained metrology data is not one of the metrology data in the set of metrology data earlier obtained. The first metrology data is transformed into a second metrology data using the one or more of the determined essential variables.
    Type: Application
    Filed: April 11, 2012
    Publication date: August 9, 2012
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Vi Vuong, Junwei Bao, Yan Chen, Weichert Heiko, Sebastien Egret
  • Transforming metrology data from a semiconductor treatment system using multivariate analysis
    Patent number: 8170833
    Abstract: Metrology data from a semiconductor treatment system is transformed using multivariate analysis. In particular, a set of metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. One or more essential variables for the obtained set of metrology data is determined using multivariate analysis. A first metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. The first obtained metrology data is not one of the metrology data in the set of metrology data earlier obtained. The first metrology data is transformed into a second metrology data using the one or more of the determined essential variables.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: May 1, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Vi Vuong, Junwei Bao, Yan Chen, Weichert Heiko, Sebastien Egret
  • TRANSFORMING METROLOGY DATA FROM A SEMICONDUCTOR TREATMENT SYSTEM USING MULTIVARIATE ANALYSIS
    Publication number: 20090094001
    Abstract: Metrology data from a semiconductor treatment system is transformed using multivariate analysis. In particular, a set of metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. One or more essential variables for the obtained set of metrology data is determined using multivariate analysis. A first metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. The first obtained metrology data is not one of the metrology data in the set of metrology data earlier obtained. The first metrology data is transformed into a second metrology data using the one or more of the determined essential variables.
    Type: Application
    Filed: December 16, 2008
    Publication date: April 9, 2009
    Applicant: Timbre Technologies, Inc.
    Inventors: Vi VUONG, Junwei BAO, Yan CHEN, Weichert HEIKO, Sebastien EGRET
  • Transforming metrology data from a semiconductor treatment system using multivariate analysis
    Patent number: 7467064
    Abstract: Metrology data from a semiconductor treatment system is transformed using multivariate analysis. In particular, a set of metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. One or more essential variables for the obtained set of metrology data is determined using multivariate analysis. A first metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. The first obtained metrology data is not one of the metrology data in the set of metrology data earlier obtained. The first metrology data is transformed into a second metrology data using the one or more of the determined essential variables.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: December 16, 2008
    Assignee: Timbre Technologies, Inc.
    Inventors: Vi Vuong, Junwei Bao, Yan Chen, Weichert Heiko, Sebastien Egret
  • Transforming metrology data from a semiconductor treatment system using multivariate analysis
    Publication number: 20070185684
    Abstract: Metrology data from a semiconductor treatment system is transformed using multivariate analysis. In particular, a set of metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. One or more essential variables for the obtained set of metrology data is determined using multivariate analysis. A first metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. The first obtained metrology data is not one of the metrology data in the set of metrology data earlier obtained. The first metrology data is transformed into a second metrology data using the one or more of the determined essential variables.
    Type: Application
    Filed: February 7, 2006
    Publication date: August 9, 2007
    Applicant: Timbre Technologies, Inc.
    Inventors: Vi Vuong, Junwei Bao, Yan Chen, Weichert Heiko, Sebastien Egret