Abstract: A capacitive humidity sensor includes a first electrode, a humidity sensitive dielectric layer, and a second electrode. The humidity sensitive dielectric layer is between the first and the second electrodes. The humidity sensitive dielectric layer is etched at selected regions to form hollow regions between the first and second electrodes.

Abstract: A digital video stream of color images intended to be displayed on a matrix screen is formed of macropixels having at least four subpixels each. During processing, the color components of each image are transformed into an RGB format based on a polygonal representation of the color components and designed for the display of images using at least four colors by activating the four subpixels. The color components of the image are adapted in the course of the transformation.

Abstract: Composite materials having conductive properties are described for use in testing circuits and in manufacturing electrical switches. The composite materials described, when in an unstressed state, generally behave as insulators. However, when sufficient mechanical pressure is applied to portions of the composite materials, the portions to which the mechanical pressure is applied become increasingly conductive. Methods for testing a PCB using composite material switches are also disclosed. A sheet that includes a composite material may be used to test electrical functionality of various regions on a PCB by way of local pressure application. The sheet may be easily applied to and removed from the PCB. Additionally, in forming an electrical switch, a voltage applied to one or more actuating elements may be used to provide mechanical pressure to a composite material that is disposed between two conductive members.

Abstract: A capacitive humidity sensor includes a first electrode, a humidity sensitive dielectric layer, and a second electrode. The humidity sensitive dielectric layer is between the first and the second electrodes. The humidity sensitive dielectric layer is etched at selected regions to form hollow regions between the first and second electrodes.

Abstract: Updating content of e-paper ESL device(s) otherwise in a powered-down state is disclosed. One or more e-paper ESL devices need only be turned on when it is desired or needed to change and update content displayed. Transmission of a wireless energy burst having a magnetic resonating power coupling characteristic powers up the e-paper ESL device from a powered-down to powered-up state. The content of the e-paper ESL device can then be changed in accordance with data and instructions transmitted with the wireless energy burst.

Abstract: Power consumption of an appliance under remote control is minimized. The appliance receives a wireless energy burst having a wireless magnetic resonating power coupling characteristic transmitted by a remote control device. The appliance is powered up from a powered-down state to a standby mode if the appliance is in the powered-down state when the wireless energy burst is received and the energy burst is of sufficient energy to activate a switched mode power supply of the appliance.

Abstract: Composite materials having conductive properties are described for use in testing circuits and in manufacturing electrical switches. The composite materials described, when in an unstressed state, generally behave as insulators. However, when sufficient mechanical pressure is applied to portions of the composite materials, the portions to which the mechanical pressure is applied become increasingly conductive. Methods for testing a PCB using composite material switches are also disclosed. A sheet that includes a composite material may be used to test electrical functionality of various regions on a PCB by way of local pressure application. The sheet may be easily applied to and removed from the PCB. Additionally, in forming an electrical switch, a voltage applied to one or more actuating elements may be used to provide mechanical pressure to a composite material that is disposed between two conductive members.

Abstract: Row propagation delay is the duration it takes for a signal to travel the length of a row in a flat panel display matrix. Row propagation delay compensation modifies when column voltages are applied to each column in a flat panel matrix by substantially matching the delay for its position relative to the length of the row. A ternary signal generated by the timing controller with embedded clock and data information is buffered at the timing controller and transmitted to each column driver as required to substantially match row propagation delay while minimizing system interconnects and column driver circuitry.

Abstract: An integrated-circuit chip includes a first electrical connection are placed on an underlying layer and covered with an intermediate dielectric layer. A second electrical connection is placed on the intermediate dielectric layer and is covered with a superficial dielectric layer. External electrical connection pads are placed on the superficial dielectric layer and extend selectively over the first electrical connection. Vias pass through the superficial dielectric layer and the intermediate dielectric layer to make connection between the first electrical connection and the external electrical connection pads.

Abstract: According to this method for processing a digital video stream of colour images intended to be displayed on a matrix screen formed of macropixels having at least four subpixels each, the colour components of each image are transformed into an RGB format based on a polygonal representation of the colour components, and designed for the display of images using at least four colours by activating the four subpixels. The colour components of the image are adapted in the course of said transformation.

Abstract: An integrated circuit chip has a dielectric surface layer and, below this layer, internal pads. The chip is fabricated by producing multiplicities of vias made of an electrically conducting material which pass through said surface layer and are positioned respectively above the internal pads. Projecting external contact pads are formed on the surface layer and connected respectively to the multiplicities of vias.

Abstract: An integrated-circuit chip includes a first electrical connection are placed on an underlying layer and covered with an intermediate dielectric layer. A second electrical connection is placed on the intermediate dielectric layer and is covered with a superficial dielectric layer. External electrical connection pads are placed on the superficial dielectric layer and extend selectively over the first electrical connection. Vias pass through the superficial dielectric layer and the intermediate dielectric layer to make connection between the first electrical connection and the external electrical connection pads.

Abstract: An integrated circuit chip has a dielectric surface layer and, below this layer, internal pads. The chip is fabricated by producing multiplicities of vias made of an electrically conducting material which pass through said surface layer and are positioned respectively above the internal pads. Projecting external contact pads are formed on the surface layer and connected respectively to the multiplicities of vias.

Abstract: A device that can be integrated into an integrated circuit dedicated to a microprocessor, this circuit comprising a direct memory access circuit and a communications cell, the communications cell comprising a state register and a sequencer that contain first information elements, the direct memory access circuit comprising a control register that contains second information elements, wherein said device comprises action means to enable the communications cell to act directly on bits of the control register in order to make certain of the second information elements identical to certain of the first information elements. Also disclosed is a method designed to eliminate possible conflicts between a direct memory access circuit and a communications cell that are due to information elements of the same nature.

Abstract: Disclosed is a synchronization circuit that can be applied in the field of monitors and, especially, in the field of television receivers. The disclosed circuit comprises circuits to analyse and correct the horizontal and vertical synchronization signals in order to neutralize the effect of the signalling present in the horizontal synchronization signal on the working of a phase-locked loop.

Abstract: Disclosed is an image display screen controller for the control of a cathode-ray tube. There is produced a blanking logic signal that begins on a leading edge of the frame synchronization square-wave pulse and ends only on the trailing edge of the VFBACK signal generated from the frame flyback pulse without getting interrupted if the frame synchronization pulse and the pulse VFBACK corresponding to the frame flyback do not overlap. An RS flip-flop circuit is activated on the leading edge of the frame synchronization square-wave pulse VSYNC and is reset only by the trailing edge of the frame flyback pulse VFBACK. The output of the RS flip-flop is applied to an input of an OR gate that receives other inputs, notably the synchronization square-wave pulses and the line and frame flyback pulses. If the scanning disappears for example by the destruction of a transistor, the absence of a frame flyback pulse will prevent the reactivation of the beam and hence prevent a dot of the screen from being burned out.

Abstract: A cell of an integrated circuit dedicated to a microprocessor, the cell comprising a data input/output circuit connected to a communications network working according to at least two different protocols called the DDC1 and I2C protocols and a control circuit provided with a sequencer, the control circuit being managed by the sequencer, the control circuit communicating with a control bus of the microprocessor and with the data input/output circuit; wherein the cell comprises a logic circuit which enforces the state of the sequencer as a function of an information element which identifies which of said protocols is being used.