Patents by Inventor Sebin CHOI

Sebin CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a semiconductor package
    Patent number: 11848301
    Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.
    Type: Grant
    Filed: March 30, 2023
    Date of Patent: December 19, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jonggu Lee, Sunghyup Kim, Byungjo Kim, Sanghoon Lee, Sukwon Lee, Sebin Choi
  • METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
    Publication number: 20230238351
    Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Inventors: Jonggu LEE, Sunghyup KIM, Byungjo KIM, Sanghoon LEE, Sukwon LEE, Sebin CHOI
  • Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same
    Patent number: 11626381
    Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: April 11, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jonggu Lee, Sunghyup Kim, Byungjo Kim, Sanghoon Lee, Sukwon Lee, Sebin Choi
  • Semiconductor chip bonding apparatus including head having thermally conductive materials
    Patent number: 11607741
    Abstract: Provided a semiconductor chip bonding apparatus including a body, a heater disposed on a lower surface of the body, a collet disposed on a lower surface of the heater, and a head disposed on a lower surface of the collet, the head has a rectangular plate shape, a lower surface and side surfaces of the head are exposed, an upper surface of the head is in contact with the lower surface of the collet, an area of the upper surface of the head is smaller than an area of the lower surface of the collet, the head includes a central section including a recess, and an outer surface constituting a part of the side surfaces of the head, and a peripheral section connected to the recess and disposed on each corners of the head, and a thermal conductivity of the peripheral section is different from that of the central section.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: March 21, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sebin Choi, Sunghyup Kim, Sukwon Lee, Jonggu Lee
  • BONDING HEAD, DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
    Publication number: 20210098415
    Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.
    Type: Application
    Filed: April 1, 2020
    Publication date: April 1, 2021
    Inventors: Jonggu LEE, Sunghyup KIM, Byungjo KIM, Sanghoon LEE, Sukwon LEE, Sebin CHOI
  • SEMICONDUCTOR CHIP BONDING APPARATUS INCLUDING HEAD HAVING THERMALLY CONDUCTIVE MATERIALS
    Publication number: 20210069811
    Abstract: Provided a semiconductor chip bonding apparatus including a body, a heater disposed on a lower surface of the body, a collet disposed on a lower surface of the heater, and a head disposed on a lower surface of the collet, the head has a rectangular plate shape, a lower surface and side surfaces of the head are exposed, an upper surface of the head is in contact with the lower surface of the collet, an area of the upper surface of the head is smaller than an area of the lower surface of the collet, the head includes a central section including a recess, and an outer surface constituting a part of the side surfaces of the head, and a peripheral section connected to the recess and disposed on each corners of the head, and a thermal conductivity of the peripheral section is different from that of the central section.
    Type: Application
    Filed: March 3, 2020
    Publication date: March 11, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sebin CHOI, Sunghyup Kim, Sukwon Lee, Jonggu Lee