Abstract: A cooling system is used to cool one or more electrical devices. An additional component is incorporated into a heat sink block to improve the ability of the heat sink to cool a heat-generating electrical device. One or more thermally conductive members are incorporated into heat sink fins to improve cooling an electrical device that is in thermal contact with the conductive members. Alternatively, one or more thermally conductive members are placed proximate to and in contact with heat sink fins to improve the cooling of an electrical device. The thermally conductive member is made of a material having a higher thermal conductivity than the material of the heat sink block.