Patents by Inventor See-Am LEE

See-Am LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Localized torsional severe plastic deformation method for conical tube metals
    Patent number: 10661335
    Abstract: In a localized torsional severe plastic deformation method for conical tube metal, a desired region of a conical tube metal can be subjected to severe plastic deformation using molds in which roughness is formed at predetermined regions. The method includes roughening a predetermined region of each of the molds; sticking the conical tube metal only to the roughened regions of the molds; moving the lower mold toward the upper mold to apply a load to the conical tube metal; and rotating the molds to apply severe plastic deformation to the conical tube metal only at the regions stuck to the roughened regions of the molds.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: May 26, 2020
    Assignee: AGENCY FOR DEFENSE DEVELOPMENT
    Inventors: Seong Lee, Seong-Ho Yang, Lee-Ju Park, Hak-Jun Kim, Hyoung-Seop Kim, See-Am Lee, Ho-Yong Um
  • LOCALIZED TORSIONAL SEVERE PLASTIC DEFORMATION METHOD FOR CONICAL TUBE METALS
    Publication number: 20180056378
    Abstract: In a localized torsional severe plastic deformation method for conical tube metal, a desired region of a conical tube metal can be subjected to severe plastic deformation using molds in which roughness is formed at predetermined regions. The method includes roughening a predetermined region of each of the molds; sticking the conical tube metal only to the roughened regions of the molds; moving the lower mold toward the upper mold to apply a load to the conical tube metal; and rotating the molds to apply severe plastic deformation to the conical tube metal only at the regions stuck to the roughened regions of the molds.
    Type: Application
    Filed: June 1, 2017
    Publication date: March 1, 2018
    Inventors: Seong LEE, Seong-Ho YANG, Lee-Ju PARK, Hak-Jun KIM, Hyoung-Seop KIM, See-Am LEE, Ho-Yong UM