Abstract: The present disclosure concerns methods and systems for increasing anonymity and traceability of a digital property management system that manages digital property transactions on a distributed transaction consensus network. The digital property management system comprises a sender's digital property manager and a recipient's digital property manager. The sender's digital property manager further comprises a sender's module and a sender's transaction node and the recipient's digital property manager further comprises a recipient' module and a recipient's transaction node. To increase anonymity of a remittance transaction between, sender's module is not allowed to access a recipient's virtual identification. Thus, recipient's module generates a token to temporarily replace a recipient's virtual identification. To increase anonymity, an encrypted label is generated for each sub-transaction to identify sub-transactions and their sequence in the same remittance set.

Abstract: An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.

Abstract: A dry film photoresist laminator includes a punch and die assembly 24 which punches a rolled sheet dry film photoresist material 14, that is comprised of a dry film photoresist material 18 sandwiched between a Mylar top layer 16 and a polyolefin bottom layer 20, into photoresist decals. The photoresist decals are bonded to a tacky transport tape 40 which carries the decals to a polyolefin peeler assembly 54 that rolls a high tack tape 57 along the polyolefin layer 20 of the decal, thereby peeling it from the decal. The decal is advanced by a laminating assembly 44 which rolls the decal onto a heated wafer 72, thereby bonding the exposed photoresist material 18 to the wafer 72. Bonded wafer 72 and decal 14 are removed from the transport tape 40. A tape transport assembly 44 carrying the transport tape and decal is advanced through the various process steps.