Patents by Inventor Seetha Lakshmi Lalitha

Seetha Lakshmi Lalitha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170125924
    Abstract: Technologies are described for methods and systems to generate a splice between a first and a second piece of conductor material. The methods may comprise identifying a first overlap area for the first piece on a first conductive surface. The first piece may include the first conductive surface and a first non-conductive surface. The methods may comprise identifying a second overlap area for the second piece on a second conductive surface. The second piece may include the second conductive surface and a second non-conductive surface. The methods may comprise pre-tinning the first and second overlap areas with solder to produce first and second pre-tinned areas. The methods may comprise stacking the first and second pieces so that the first and second pre-tinned areas are in contact and applying heat to the first non-conductive surface sufficient to melt the solder and generate the splice between the first and second pieces.
    Type: Application
    Filed: April 21, 2015
    Publication date: May 4, 2017
    Inventor: Seetha Lakshmi Lalitha