Patents by Inventor Se-gi BYUN

Se-gi BYUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method of manufacturing the same
    Patent number: 10076801
    Abstract: A method of manufacturing a semiconductor package including coating a flux on a connection pad provided on a first surface of a substrate, the flux including carbon nanotubes (CNTs), placing a solder ball on the connection pad coated with the flux, forming a solder layer attached to the connection pad from the solder ball through a reflow process, and mounting a semiconductor chip on the substrate such that the solder layer faces a connection pad in the semiconductor chip may be provided.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: September 18, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-woo Song, Sung-il Cho, Se-gi Byun, Jin Yu
  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20170246699
    Abstract: A method of manufacturing a semiconductor package including coating a flux on a connection pad provided on a first surface of a substrate, the flux including carbon nanotubes (CNTs), placing a solder ball on the connection pad coated with the flux, forming a solder layer attached to the connection pad from the solder ball through a reflow process, and mounting a semiconductor chip on the substrate such that the solder layer faces a connection pad in the semiconductor chip may be provided.
    Type: Application
    Filed: February 27, 2017
    Publication date: August 31, 2017
    Applicants: Samsung Electronics Co., Ltd., Korea Advanced Institute of Science and Technology
    Inventors: Min-woo SONG, Sung-il CHO, Se-gi BYUN, Jin YU