Patents by Inventor Seh H. Oh

Seh H. Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor lead frame having a down set support member formed by inwardly extending leads within a central aperture
    Patent number: 5455454
    Abstract: A semiconductor lead frame is disclosed. An adhesive tape is attached on one end part of inner leads and a bus bar, and a semiconductor chip is mounted on the adhesive tape without using a conventional die pad, wherein the inner leads is formed with a gap to be separated from neighboring leads by etching and the adhesive tape is supported by the bus bar so that the reliability of a semiconductor package is enhanced, and a labor for the development and production of the semiconductor package is saved because semiconductor chips of a variable size can be mounted on the same kind of the semiconductor package by changing only the adhesive tape without preparing another lead frame.
    Type: Grant
    Filed: September 21, 1993
    Date of Patent: October 3, 1995
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seh H. Oh, Do S. Jeung