Abstract: A method for dispensing a liquid onto a tape having at least one window. The method involves supplying a tape having at least one window and attaching a film to one side of the tape. Liquid is dispensed to the side of the tape opposite the side to which the film is applied. The film is thereafter separated from the tape.

Abstract: An apparatus for dispensing a liquid or encapsulating a semiconductor device package on a tape is disclosed. The apparatus comprises: a dispensing station for dispensing a liquid encapsulant on the tape; a tape transfer station; a cover film attaching station for attaching a cover film to the tape to screen windows of the tape; and a cover film detaching station. The cover film is automatically attached to and separated from the tape by the cover film attaching station and the cover film detaching station. The apparatus prevents the liquid from flowing under the tape. In addition, a method for encapsulating a semiconductor device package having a tape is disclosed.

Abstract: An apparatus for dispensing a liquid or encapsulating a semiconductor device package on a tape is disclosed. The apparatus comprises: a dispensing station for dispensing a liquid encapsulant on the tape; a tape transfer station; a cover film attaching station for attaching a cover film to the tape to screen windows of the tape; and a cover film detaching station. The cover film is automatically attached to and separated from the tape by the cover film attaching station and the cover film detaching station. The apparatus prevents the liquid from flowing under the tape. In addition, a method for encapsulating a semiconductor device package having a tape is disclosed.

Abstract: A circuit board for detecting disconnection of a bonding wire, includes a circuit board body; a pattern layer having a die pad region formed on an upper surface of the circuit board body for mounting a semiconductor chip thereon, and respective conductive wire patterns formed on the upper surface and an opposite lower surface of the circuit board body for electrically connecting the semiconductor chip; and via holes perforating through the circuit board body for connecting the conductive wire patterns. The pattern layer further includes bonding leads formed at one end of the conductive wire patterns and connected to the semiconductor chip by bonding wires for electrical connection between the semiconductor chip and the circuit board, and earth terminals formed outside of the die pad region and connected to a device for clamping the circuit board during electrical connection between the semiconductor chip and the circuit board by wire bonding.