Abstract: Disclosed is a thin film characteristic measuring apparatus, which is used for measuring the thickness or width of a thin film of an object to be examined. The thin film characteristic measuring apparatus comprises a light source, a first reflecting mirror, a first actuator and a lens assembly. The lens assembly is formed so that the angle formed by an optical axis and a chief ray of the rays transmitted through the lens assembly is less than or equal to the angle formed by the optical axis and a chief ray of the rays incident to the lens assembly. The light source can comprise superluminescent diodes (SLD).

Abstract: Disclosed is a thin film characteristic measuring apparatus, which is used for measuring the thickness or width of a thin film of an object to be examined. The thin film characteristic measuring apparatus comprises a light source, a first reflecting mirror, a first actuator and a lens assembly. The lens assembly is formed so that the angle formed by an optical axis and a chief ray of the rays transmitted through the lens assembly is less than or equal to the angle formed by the optical axis and a chief ray of the rays incident to the lens assembly. The light source can comprise superluminescent diodes (SLD).

Abstract: A lithography apparatus is provided. The apparatus includes: a stage, a first light source unit, an optical system, an image obtaining means, an image edit means, an LC panel, and a second light source unit. The LC panel is coupled with the optical system and receives a signal of the image edited by the image edit means and displays the received image to perform a photo mask function. The second light source unit provides light used in performing an exposure on the test material using the imaged displayed on the LC panel for a photo mask.

Abstract: The present invention provides a flexible wire grid polarizer used in a visible ray band and a fabricating method thereof. The present invention includes the steps of forming a non-adhesive layer on an inner area of a lower substrate, forming a flexible polymer substrate on the lower substrate including the non-adhesive layer, forming a thin metal layer on the flexible polymer substrate, forming a metal grid pattern by etching the thin metal layer, dicing a wafer staying within a boundary of the non-adhesive layer on the lower substrate, and separating the lower substrate including the non-adhesive layer from the diced wafer to complete the flexible wire grid polarizer.