Patents by Inventor Sehat Setardja

Sehat Setardja has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging DRAM and SOC in an IC package
    Patent number: 8896126
    Abstract: An integrated circuit package includes a first memory die having a first set of connections, a second memory die arranged adjacent to the first memory die, the second memory die having a second set of connections, a first substrate having a first opening and a second opening, the first substrate having a third set of connections to connect to the first set of connections of the first memory die via the first opening and a fourth set of connections to connect to the second set of connections of the second memory die via the second opening, and a second substrate having a first integrated circuit disposed thereon. The first substrate is connected to the second substrate with the first integrated circuit disposed between the first substrate and second substrate.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: November 25, 2014
    Assignee: Marvell World Trade Ltd.
    Inventor: Sehat Setardja