Abstract: Disclosed are semiconductor devices, electronic systems including the same, and methods of fabricating the same. The semiconductor device comprises a first gate stack structure including a first dielectric pattern and a first conductive pattern that are alternately stacked with each other, a memory channel structure including a first memory portion that penetrates the first gate stack structure, a through contact including a first through portion at a level the same as a level of the first memory portion, and a connection contact including a first connection portion at a level the same as the level of the first memory portion and the level of the first through portion. A minimum width of the first memory portion is less than a minimum width of the first through portion and a minimum width of the first connection portion.

Abstract: Systems and methods are provided for a container which may be assembled in a single motion. In one example, a method may include pulling a drawstring through a drawstring channel opening in a first panel of the container, wherein pulling the drawstring: folds each of a first triangular panel, a second triangular panel, a third triangular panel and a fourth triangular panel in half towards an interior of the container; lifts each of the first panel, the second panel, the third panel, and the fourth panel towards the interior of the container to a vertical position; and securing the drawstring to hold the container in an assembled configuration.