Abstract: Plasma processing apparatuses, substrate bonding systems, and substrate bonding methods are provided. The plasma processing apparatus includes a plasma process chamber that includes a process space, a load-lock chamber connected to the process space, a first vacuum pump that adjusts a pressure of the load-lock chamber, a process gas supply that supplies the process space with a process gas, and an H2O supply that supplies the process space with H2O. The plasma process chamber includes a chuck that supports a substrate and a plasma electrode to which a radio-frequency (RF) power is applied.

Abstract: According to an exemplary embodiment of the present invention, provided is a method for manufacturing a superconductor including magnesium diboride, the method including: a first mixture preparation step of preparing a first mixture including a boron powder and a liquid chlorinated hydrocarbon compound; a second mixture preparation step of preparing a second mixture including the first mixture and a magnesium powder; a molded body manufacturing step of manufacturing a molded body by pressurizing the second mixture; and a sintering step of sintering the molded body to manufacture a superconductor including magnesium diboride.

Abstract: A method for fabricating a semiconductor device includes loading a substrate into a process chamber, processing the substrate in the process chamber, using a plasma generated inside the process chamber, receiving a plasma light emitted from the plasma, selecting a target light from the plasma light, such that the target light is related to a surface condition of the substrate, and analyzing an intensity of the target light over time to monitor the surface condition of the substrate.

Abstract: According to an exemplary embodiment of the present invention, provided is a method for manufacturing a superconductor including magnesium diboride, the method including: a first mixture preparation step of preparing a first mixture including a boron powder and a liquid chlorinated hydrocarbon compound; a second mixture preparation step of preparing a second mixture including the first mixture and a magnesium powder; a molded body manufacturing step of manufacturing a molded body by pressurizing the second mixture; and a sintering step of sintering the molded body to manufacture a superconductor including magnesium diboride.

Abstract: A coil component includes a first coil part including a multilayer substrate on which a conductor pattern is formed, a second coil part formed as a wire and stacked together with the first coil part, a core coupled to the first and second coil parts while penetrating through the first and second coil parts to thereby be electromagnetically coupled to the first and second coil parts, and a pressing member interposed between the core and the second coil part to allow the first and second coil parts to closely adhere to each other.

Abstract: A coil component includes a first coil part including a multilayer substrate on which a conductor pattern is formed, a second coil part formed as a wire and stacked together with the first coil part, a core coupled to the first and second coil parts while penetrating through the first and second coil parts to thereby be electromagnetically coupled to the first and second coil parts, and a pressing member interposed between the core and the second coil part to allow the first and second coil parts to closely adhere to each other.

Abstract: A coil component includes a first coil part including a multilayer substrate on which a conductor pattern is formed, a second coil part formed as a wire and stacked together with the first coil part, a core coupled to the first and second coil parts while penetrating through the first and second coil parts to thereby be electromagnetically coupled to the first and second coil parts, and a pressing member interposed between the core and the second coil part to allow the first and second coil parts to closely adhere to each other.

Abstract: A coil component includes a first coil part including a multilayer substrate on which a conductor pattern is formed, a second coil part formed as a wire and stacked together with the first coil part, a core coupled to the first and second coil parts while penetrating through the first and second coil parts to thereby be electromagnetically coupled to the first and second coil parts, and a pressing member interposed between the core and the second coil part to allow the first and second coil parts to closely adhere to each other.

Abstract: The coil component includes a core, first and second coil parts coupled to the core while being stacked with each other, and an insulating member accommodating the second coil part therein. In addition, the second coil part is formed of a flat-type wire.

Abstract: A semiconductor device includes a substrate including a front side and a back side opposite the front side, first P-type regions located adjacent to the back side and spaced apart from each other in the substrate, N-type regions located under the first P-type regions and spaced apart from each other in the substrate, and second P-type regions located adjacent to the back side and located between the first P-type regions.

Abstract: A backlight assembly has improved luminance and uniformity, and a liquid crystal display includes the backlight assembly. The backlight assembly may be constructed with a light source; a flexible printed circuit board including a base film and conductors, and mounted with the light source; a light guide panel into which light emitted from the light source is incident; and a mold frame including an opening for receiving the light guide panel and a boss for fixing the flexible printed circuit board. The flexible printed circuit board is provided with an insertion hole into which the boss is inserted, and the conductors are formed along the circumference of the insertion hole.

Abstract: A semiconductor device includes a substrate including a front side and a back side opposite the front side, first P-type regions located adjacent to the back side and spaced apart from each other in the substrate, N-type regions located under the first P-type regions and spaced apart from each other in the substrate, and second P-type regions located adjacent to the back side and located between the first P-type regions.

Abstract: A backlight assembly has improved luminance and uniformity, and a liquid crystal display includes the backlight assembly. The backlight assembly may be constructed with a light source; a flexible printed circuit board including a base film and conductors, and mounted with the light source; a light guide panel into which light emitted from the light source is incident; and a mold frame including an opening for receiving the light guide panel and a boss for fixing the flexible printed circuit board. The flexible printed circuit board is provided with an insertion hole into which the boss is inserted, and the conductors are formed along the circumference of the insertion hole.

Abstract: The present invention provides an inverter connection terminal assembly for an electric compressor. The inverter connection terminal assembly includes a connection terminal, in which upper and lower terminal projections project from the upper and lower surfaces of a plate, respectively, an inverter connection cable connected to the upper terminal projection of the connection terminal, a motor connection cable connected to the lower terminal projection of the connection terminal, an upper connector for connecting the upper terminal projection and the inverter connection cable, and a lower connector for connecting the lower terminal projection and the motor connection cable, wherein the lower terminal projection of the connection terminal includes a thread formed on the surface thereof such that the motor connection cable is fixed to the lower terminal projection by fastening a nut while a washer and a ring connector are sequentially inserted into the lower terminal projection.

Abstract: The present invention provides an inverter connection terminal assembly for an electric compressor. The inverter connection terminal assembly includes a connection terminal, in which upper and lower terminal projections project from the upper and lower surfaces of a plate, respectively, an inverter connection cable connected to the upper terminal projection of the connection terminal, a motor connection cable connected to the lower terminal projection of the connection terminal, an upper connector for connecting the upper terminal projection and the inverter connection cable, and a lower connector for connecting the lower terminal projection and the motor connection cable, wherein the lower terminal projection of the connection terminal includes a thread formed on the surface thereof such that the motor connection cable is fixed to the lower terminal projection by fastening a nut while a washer and a ring connector are sequentially inserted into the lower terminal projection.

Abstract: A mobile communication terminal including at least one side key, a display unit including a touch screen and a controller configured to display on the display unit an interface screen when the at least one side key is manipulated, said interface screen including selectable items for setting at least one of a receiving call alert mode of the terminal and a button alert mode of the terminal.