Patents by Inventor Sehoon Yoo

Sehoon Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for filling a wafer via with solder
    Patent number: 10115635
    Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: October 30, 2018
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Sehoon Yoo, Chang Woo Lee, Jun Ki Kim, Jeong Han Kim, Young Ki Ko
  • METHOD FOR FILLING A WAFER VIA WITH SOLDER
    Publication number: 20180301377
    Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.
    Type: Application
    Filed: February 3, 2017
    Publication date: October 18, 2018
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Sehoon Yoo, Chang Woo LEE, Jun Ki KIM, Jeong Han KIM, Young Ki KO
  • APPARATUS AND METHODS FOR FILLING A WAFER VIA WITH SOLDER
    Publication number: 20170148678
    Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.
    Type: Application
    Filed: February 3, 2017
    Publication date: May 25, 2017
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Sehoon Yoo, Chang Woo LEE, Jun Ki KIM, Jeong Han KIM, Young Ki KO
  • Apparatus for filling a wafer via with solder
    Patent number: 9603254
    Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: March 21, 2017
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Sehoon Yoo, Chang Woo Lee, Jun Ki Kim, Jeong Han Kim, Young Ki Ko
  • APPARATUS FOR FILLING A WAFER VIA WITH SOLDER AND HAVING A PRESSURE UNIT, AND METHOD FOR FILLING A WAFER VIA WITH SOLDER USING SAME
    Publication number: 20140123488
    Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.
    Type: Application
    Filed: July 10, 2012
    Publication date: May 8, 2014
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Sehoon Yoo, Chang Woo Lee, Jun Ki Kim, Jeong Han Kim, Young Ki Ko
  • Method of forming nanostructures on ceramics
    Patent number: 7303723
    Abstract: A method for manufacturing oriented arrays of ceramic or metal oxide nanostructures, such as titania (TiO2) nanofibers. The nanofibers are formed on the surface of a body that is first sintered at a temperature in the range of about 1,100 to about 1,400 degrees Celsius. Subsequently, the surface is exposed to an H2-bearing gas, such as H2 and N2 in a ratio of about 5:95 at about 700 degrees Celsius for about 8 hours. During heat treatment in the gas phase reaction, sintered titania grains transform into arrays of nanofibers oriented in the same crystallographic direction.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: December 4, 2007
    Assignee: The Ohio State University Research Foundation
    Inventors: Sheikh A. Akbar, Sehoon Yoo, Kenneth H. Sandhage
  • Method of forming nanostructures on ceramics and the ceramics formed
    Publication number: 20040126624
    Abstract: A method for manufacturing oriented arrays of ceramic or metal oxide nanostructures, such as titania (TiO2) nanofibers. The nanofibers are formed on the surface of a body that is first sintered at a temperature in the range of about 1,100 to about 1,400 degrees Celsius. Subsequently, the surface is exposed to an H2-bearing gas, such as H2 and N2 in a ratio of about 5:95 at about 700 degrees Celsius for about 8 hours. During heat treatment in the gas phase reaction, sintered titania grains transform into arrays of nanofibers oriented in the same crystallographic direction.
    Type: Application
    Filed: October 3, 2003
    Publication date: July 1, 2004
    Inventors: Sheikh A. Akbar, Sehoon Yoo, Kenneth H. Sandhage