Patents by Inventor Se-Hui Jang

Se-Hui Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11200852
    Abstract: Provided herein may be a display device, which may include a display panel including a pixel column having a first pixel and a second pixel, a first data line coupled to the first pixel, and a second data line coupled to the second pixel, a data driver configured to output a data signal for the pixel column to an output line, a signal distribution circuit configured to receive the data signal through the output line, and to alternately transmit the data signal to the first data line and to the second data line, and a signal transmission circuit coupled between the data driver and the output line, and configured to transmit the data signal to the output line during a first period and a second period, and to block transmission of the data signal during a third period that is between the first period and the second period.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: December 14, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Ok Kwon Shin, Bong Ho Bae, Chong Guk Lee, Myeong Bin Lim, Hyun Ho Lim, Se Hui Jang
  • Publication number: 20200184900
    Abstract: Provided herein may be a display device, which may include a display panel including a pixel column having a first pixel and a second pixel, a first data line coupled to the first pixel, and a second data line coupled to the second pixel, a data driver configured to output a data signal for the pixel column to an output line, a signal distribution circuit configured to receive the data signal through the output line, and to alternately transmit the data signal to the first data line and to the second data line, and a signal transmission circuit coupled between the data driver and the output line, and configured to transmit the data signal to the output line during a first period and a second period, and to block transmission of the data signal during a third period that is between the first period and the second period.
    Type: Application
    Filed: August 6, 2019
    Publication date: June 11, 2020
    Inventors: Ok Kwon SHIN, Bong Ho BAE, Chong Guk LEE, Myeong Bin LIM, Hyun Ho LIM, Se Hui JANG
  • Patent number: 10031385
    Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: July 24, 2018
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Chong-Guk Lee, Joo-Yeon Won, Se-Hui Jang, Su-Mi Moon, Dong-Wook Lee
  • Patent number: 9953600
    Abstract: A display apparatus includes a first substrate and a second substrate. The first substrate includes a switching element and a pixel electrode electrically connected to the switching element. A display panel driver applies a driving signal to the display panel. The display panel driver includes a printed circuit board including a first bonding pad and a flexible substrate electrically connecting the printed circuit board with the display panel. The flexible substrate includes a second bonding pad. The second bonding pad is electrically connected to the first bonding pad of the printed circuit board. The first bonding pad overlaps the second bonding pad. At least a portion of the first bonding pad and at least a portion of the second bonding pad extend in a direction which is at an acute angle with respect to a first direction parallel with a relatively longer side of the display panel.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: April 24, 2018
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Se-Hui Jang, Chong-Guk Lee, Sang-Moon Moh, Su-Mi Moon
  • Publication number: 20170261799
    Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.
    Type: Application
    Filed: May 25, 2017
    Publication date: September 14, 2017
    Inventors: CHONG-GUK LEE, JOO-YEON WON, SE-HUI JANG, SU-Ml MOON, DONG-WOOK LEE
  • Patent number: 9664964
    Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: May 30, 2017
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Chong-Guk Lee, Joo-Yeon Won, Se-Hui Jang, Su-Mi Moon, Dong-Wook Lee
  • Publication number: 20170069253
    Abstract: A display apparatus includes a first substrate and a second substrate. The first substrate includes a switching element and a pixel electrode electrically connected to the switching element. A display panel driver applies a driving signal to the display panel. The display panel driver includes a printed circuit board including a first bonding pad and a flexible substrate electrically connecting the printed circuit board with the display panel. The flexible substrate includes a second bonding pad. The second bonding pad is electrically connected to the first bonding pad of the printed circuit board. The first bonding pad overlaps the second bonding pad. At least a portion of the first bonding pad and at least a portion of the second bonding pad extend in a direction which is at an acute angle with respect to a first direction parallel with a relatively longer side of the display panel.
    Type: Application
    Filed: April 29, 2016
    Publication date: March 9, 2017
    Inventors: SE-HUI JANG, Chong-Guk Lee, Sang-Moon Moh, Su-Mi Moon
  • Publication number: 20160062172
    Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate, The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line, The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.
    Type: Application
    Filed: April 3, 2015
    Publication date: March 3, 2016
    Inventors: Chong-Guk Lee, Joo-Yeon Won, Se-Hui Jang, Su-Mi Moon, Dong-Wook Lee