Abstract: A display device includes a substrate including an opening hole, a first barrier insulating layer on the substrate, a plurality of first pad portions on the first barrier insulating layer and in a first contact hole partially penetrating the first barrier insulating layer, a second barrier insulating layer on the first barrier insulating layer and the plurality of first pad portions, a plurality of second pad portions on the second barrier insulating layer and in a second contact hole partially penetrating the first barrier insulating layer and the second barrier insulating layer, a third barrier insulating layer on the second barrier insulating layer and the plurality of second pad portions, a display layer on the third barrier insulating layer, and a flexible film under the substrate, and inserted into the opening hole to be electrically connected to the plurality of first and second pad portions.

Abstract: A display device of a tiled display includes a first substrate including an opening hole, a laser absorption layer disposed on the first substrate, including amorphous silicon, and multiple first contact holes, a first barrier insulating layer disposed on the laser absorption layer and including multiple second contact holes overlapping the first contact holes, multiple pad portions disposed on the first barrier insulating layer and partially disposed in the second contact holes, a second barrier insulating layer disposed on the first barrier insulating layer and the pad portions, a display layer disposed on the second barrier insulating layer, and a flexible film disposed under the first substrate, inserted into the opening hole, and electrically connected to the pad portions. A portion of the first barrier insulating layer is disposed in each of the first contact holes. The pad portions are electrically insulated from the laser absorption layer.

Abstract: A display device includes a base layer including a first base layer and a second base layer disposed on a rear surface of the first base layer, light emitting elements disposed on a surface of the first base layer, and pads including a first pad and a second pad, which are disposed on the rear surface of the first base layer and are spaced apart from each other. The base layer further includes blocking layers which are disposed between the first base layer and the second base layer and at least portions of the blocking layers do not overlap the pads in a plan view. The blocking layers include a first blocking layer and a second blocking layer, which are disposed in different layers.

Abstract: A display device comprises a first substrate comprising a first contact hole, a laser absorption layer disposed on the first substrate and containing amorphous silicon, a first barrier insulating layer disposed on the laser absorption layer, fan-out lines disposed in a metal layer on the first barrier insulating layer and comprising pad portions inserted into second contact holes provided in the first barrier insulating layer and the laser absorption layer, a second barrier insulating layer disposed on the metal layer, a second substrate disposed on the second barrier insulating layer, and a display layer disposed on the second substrate. The second substrate is inserted into a third contact hole provided in the second barrier insulating layer, the first barrier insulating layer, and the laser absorption layer disposed between the pad portions.

Abstract: A display device includes a base layer including an upper base layer and a lower base layer on a rear surface of the upper base layer; at least one light emitting element on a surface of the upper base layer; and at least one pad on the rear surface of the upper base layer and including a first pad layer adjacent to the upper base layer and a second pad layer adjacent to the lower base layer. The second pad layer includes indium zinc oxide (IZO).

Abstract: A display device includes a substrate, a first metal layer on the substrate, a first barrier insulating layer on the first metal layer, an etching control layer on the first barrier insulating layer, a first contact hole passing through the substrate, the first barrier insulating layer, and the etching control layer, a second barrier insulating layer on the etching control layer and including a second contact hole, a fan-out line on the second barrier insulating layer and included in a second metal layer, a pad part inserted into the second contact hole and included in the second metal layer, the pad part integral with the fan-out line, a display layer on the fan-out line, and a flexible film under the substrate and inserted into the first contact hole to be electrically connected to the pad part. The first metal layer includes an etching mark adjacent to the first contact hole.

Abstract: A display device comprises a first substrate including a first contact hole, a first barrier insulating layer disposed on the first substrate and including second contact holes overlapping the first contact hole, pad electrodes disposed on the first barrier insulating layer, at least a subset of the pad electrodes being disposed in the second contact holes, a display layer disposed on the pad electrodes, and a flexible film disposed below the first substrate and electrically connected to the pad electrodes through the first contact hole and the second contact holes, wherein the first substrate includes a substrate buffer portion overlapping the first contact hole and not-overlapping the second contact holes.

Abstract: A display device, a method of manufacturing the same and a tiled display device including the same are provided. The display device includes a first substrate including a first contact hole, a first barrier insulating layer disposed on the first substrate and including a second contact hole overlapping the first contact hole in a thickness direction, a capping layer disposed on the first barrier insulating layer, at least a portion of the capping layer being disposed in the second contact hole and the first contact hole, a pad electrode disposed on the capping layer, a display layer disposed on the pad electrode, and a flexible film disposed under the first substrate and electrically connected to the pad electrode through the first contact hole and the second contact hole.

Abstract: Provided is a surface treatment method of a polishing pad. The surface treatment method of the polishing pad includes locating a wafer on the polishing pad including a polishing material, supplying a polishing pad polishing material between the polishing pad and the wafer to expose the polishing material included in the polishing pad, and polishing the wafer using the exposed polishing material.