Patents by Inventor Sei-Cheol Lee

Sei-Cheol Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
    Patent number: 7858527
    Abstract: An additive composition for a slurry contains a first salt of polymeric acid including a first polymeric acid having a first weight average molecular weight and a first base material, and a second salt of polymeric acid including a second polymeric acid having a second weight average molecular weight and a second base material. A slurry composition is prepared by mixing the additive composition, a polishing particle composition, and water. When implementing a chemical mechanical polishing using the slurry composition, a favorable polishing selectivity is realized.
    Type: Grant
    Filed: September 26, 2007
    Date of Patent: December 28, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Nam-Soo Kim, Sang-Mun Chon, Young-Sam Lim, Kyoung-Moon Kang, Sei-Cheol Lee, Jae-Hyun So, Dong-Jun Lee
  • ADDITIVE COMPOSITION, SLURRY COMPOSITION INCLUDING THE SAME, AND METHOD OF POLISHING AN OBJECT USING THE SLURRY COMPOSITION
    Publication number: 20080014838
    Abstract: An additive composition for a slurry contains a first salt of polymeric acid including a first polymeric acid having a first weight average molecular weight and a first base material, and a second salt of polymeric acid including a second polymeric acid having a second weight average molecular weight and a second base material. A slurry composition is prepared by mixing the additive composition, a polishing particle composition, and water. When implementing a chemical mechanical polishing using the slurry composition, a favorable polishing selectivity is realized.
    Type: Application
    Filed: September 26, 2007
    Publication date: January 17, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Nam-Soo KIM, Sang-Mun CHON, Young-Sam LIM, Kyoung-Moon KANG, Sei-Cheol LEE, Jae-Hyun SO, Dong-Jun LEE
  • Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
    Patent number: 7288212
    Abstract: An additive composition for a slurry contains a first salt of polymeric acid including a first polymeric acid having a first weight average molecular weight and a first base material, and a second salt of polymeric acid including a second polymeric acid having a second weight average molecular weight and a second base material. A slurry composition is prepared by mixing the additive composition, a polishing particle composition, and water. When implementing a chemical mechanical polishing using the slurry composition, a favorable polishing selectivity is realized.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: October 30, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Nam-Soo Kim, Sang-Mun Chon, Young-Sam Lim, Kyoung-Moon Kang, Sei-Cheol Lee, Jae-Hyun So, Dong-Jun Lee
  • Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
    Publication number: 20030092265
    Abstract: An additive composition for a slurry contains a first salt of polymeric acid including a first polymeric acid having a first weight average molecular weight and a first base material, and a second salt of polymeric acid including a second polymeric acid having a second weight average molecular weight and a second base material. A slurry composition is prepared by mixing the additive composition, a polishing particle composition, and water. When implementing a chemical mechanical polishing using the slurry composition, a favorable polishing selectivity is realized.
    Type: Application
    Filed: November 14, 2002
    Publication date: May 15, 2003
    Inventors: Nam-Soo Kim, Sang-Mun Chon, Young-Sam Lim, Kyoung-Moon Kang, Sei-Cheol Lee, Jae-Hyun So, Dong-Jun Lee