Patents by Inventor Sei-Gu Lee

Sei-Gu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test coupon for measuring a dielectric constant of a memory module board and method of use
    Patent number: 6670816
    Abstract: A test coupon for measuring a dielectric constant of a memory module substrate has a plurality of test pattern layers each having a long trace and a short trace formed thereon. A first test pattern layer has an exposed surface and a second test pattern layer is formed internally. The first test pattern layer has probe pads respectively connected to the long and short traces of the first and second pattern layers. Probe pads of the first test pattern layer are connected to a via contact of the second test pattern layer by via holes. The via contact of the second pattern layer is connected to the long and short traces of the second pattern layer. The test coupon is used to measure the dielectric constant of a module board.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: December 30, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-Hyun Kim, Sei-Gu Lee, Joung-Rhang Lee
  • Test coupon for measuring a dielectric constant of a memory module board and method of use
    Publication number: 20020106822
    Abstract: A test coupon for measuring a dielectric constant of a memory module substrate has a plurality of test pattern layers each having a long trace and a short trace formed thereon. A first test pattern layer has an exposed surface and a second test pattern layer is formed internally. The first test pattern layer has probe pads respectively connected to the long and short traces of the first and second pattern layers. Probe pads of the first test pattern layer are connected to a via contact of the second test pattern layer by via holes. The via contact of the second pattern layer is connected to the long and short traces of the second pattern layer. The test coupon is used to measure the dielectric constant of a module board.
    Type: Application
    Filed: December 28, 2001
    Publication date: August 8, 2002
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yong-Hyun Kim, Sei-Gu Lee, Joung-Rhang Lee