Abstract: A system having a memory device accessible by a plurality of processors is provided. The system includes a memory device, a first processor, and a second processor. The memory device has a first memory array part and a second memory array part. The first processor predominantly accesses the first memory array part of the memory device and selectively accesses the second memory array part of the memory device. The second processor predominantly accesses the second memory array part of the memory device and selectively accesses the first memory array part of the memory device.

Abstract: A semiconductor device includes a memory cell array, including at least one of a plurality of memory cells storing program data received from a flash memory, a row address buffer, which receives a row address signal in response to a first strobe signal, and a column address buffer, which receives a column address signal in response to a second strobe signal. The device further includes a write protection circuit, enabled/disabled in response to a first control signal, the write protection circuit outputting a masking control signal in response to the row address signal, the second strobe signal, and second control signals when enabled, and a column decoder, which decodes the column address signal in response to the masking control signal and enables at least one of a plurality of column selection lines of the memory cell array, corresponding to the decoded column address signal, or disables the column selection lines.

Abstract: A memory system includes a first external device, a second external device, and a multi-port memory device connected to the first and second external devices. The multi-port memory system includes: a first port and a second port connected to the first and second external devices, respectively, a first bank group having at least one memory bank, the first bank group configured to be accessed by the first external device through the first data port; a second bank group having at least one memory bank, the second bank group configured to be accessed by the second external device through the second data port; a third bank group having at least one memory bank, wherein the third bank group is configured to be selectively accessed by the first external device through the first data port or the second external device through the second data port. The multi-port memory system may prevent data collisions which occur when two ports simultaneously attempt to access the same memory bank.

Abstract: A semiconductor device is provided. The semiconductor device includes a storage part storing an address for weak cells in a nonvolatile state; and a dynamic semiconductor memory device including: a memory cell array having normal cells and the weak cells to be refreshed; and a refresh control part performing a refresh operation for the weak cells, wherein a refresh period for the weak cells is shorter than a refresh period for the normal cells when the address applied in a refresh operation mode coincides with the address stored in the storage part.

Abstract: A semiconductor device includes a memory cell array, including at least one of a plurality of memory cells storing program data received from a flash memory, a row address buffer, which receives a row address signal in response to a first strobe signal, and a column address buffer, which receives a column address signal in response to a second strobe signal. The device further includes a write protection circuit, enabled/disabled in response to a first control signal, the write protection circuit outputting a masking control signal in response to the row address signal, the second strobe signal, and second control signals when enabled, and a column decoder, which decodes the column address signal in response to the masking control signal and enables at least one of a plurality of column selection lines of the memory cell array, corresponding to the decoded column address signal, or disables the column selection lines.

Abstract: A display data control circuit can include a sequentially accessed memory circuit that is configured to sequentially store/retrieve image data for display received via data pins of the sequentially accessed memory circuit and a timing controller circuit that is configured to provide addressing information to the sequentially accessed memory circuit via the data pins thereof.

Abstract: A multi-port volatile memory device includes a first port configured for data transfer to/from an external host system and the device. A volatile main memory core is configured to store data received thereat and read requested stored data thereform. A volatile sub memory core is configured to store data received thereat and read requested stored data therefrom. A main interface circuit is coupled to the first port and configured to provide data to/from the volatile main memory core and the first port in a master mode and configured to provide data to/from the volatile sub memory core and the first port in a slave mode. A second port is configured for data transfer to/from an external non-volatile memory device and the device. A sub interface circuit is coupled to the second port and configured to provide data to/from the volatile sub memory core and the second port in the slave mode.

Abstract: Circuits and methods for controlling data I/O operations in semiconductor memory devices to provide variable data I/O widths for read, write and active memory operations. Circuits and methods for selectively controlling a data width of a data I/O buffer “on the fly” to enable variable data I/O widths during memory access operations.

Abstract: DRAM and SRAM devices have a NAND interface mode (pins whose address and data are identical to one another are commonly used), directly being coupled to buses (an address/data bus and a control bus) of a NAND-type flash memory device that is connected to a microprocessor. Upon such a common interface mode, a DRAM device, an SRAM device, a NAND-type flash memory device, and a NOR-type flash memory device have the identical interface mode, and are independently (or individually) controlled by only one memory controller.

Abstract: DRAM and SRAM devices have a NAND interface mode (pins whose address and data are identical to one another are commonly used), directly being coupled to buses (an address/data bus and a control bus) of a NAND-type flash memory device that is connected to a microprocessor. Upon such a common interface mode, a DRAM device, an SRAM device, a NAND-type flash memory device, and a NOR-type flash memory device have the identical interface mode, and are independently (or individually) controlled by only one memory controller.

Abstract: A semiconductor memory device for improving the transmission data rate of a data input and output bus, and a memory module including the same, are provided. The memory module includes a plurality of clock synchronous memory devices that share a single data bus line. More specifically, the memory module includes a printed circuit board having an electrical connector including the data bus line, a first set of synchronous memory devices arrayed on the printed circuit board, a second set of synchronous memory devices arrayed on the print circuit board, and a clock signal generator electrically connected to the first and second set of synchronous memory devices. The clock signal generator operates to receive a clock signal from the electrical connector and to generate a first clock signal that is matched with the received clock signal and a second clock signal that is delayed with respect to the received clock signal for half the period of the received clock signal.

Abstract: In a semiconductor memory device, and in particular in a NAND-type ROM memory cell, the transistors of a memory cell region and a peripheral circuit portion are manufactured to include a first and second impurity regions. The second impurity region has a higher impurity density impurity than the first impurity region. A third impurity region is added which has a higher impurity density and shallower depth than the impurity density of the first impurity region. Accordingly, the conventional transistor structure of the peripheral circuit portion is maintained while the transistors of the memory cell are optimized to have ideal electrical characteristics, including an increased current driving capability.

Abstract: In a semiconductor memory device, and in particular in a NAND-type ROM memory cell, the transistors of a memory cell region and a peripheral circuit portion are manufactured to include a first and second impurity regions. The second impurity region has a higher impurity density impurity than the first impurity region. A third impurity region is added which has a higher impurity density and shallower depth than the impurity density of the first impurity region. Accordingly, the conventional transistor structure of the peripheral circuit portion is maintained while the transistors of the memory cell are optimized to have ideal electrical characteristics, including an increased current driving capability.