Patents by Inventor Sei Kawao

Sei Kawao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11798585
    Abstract: A disk drive suspension of the embodiments includes a load beam, and a flexure including a mounting portion on which a slider is mounted and overlapping with the load beam. The load beam includes a tab further extending than the mounting portion longitudinal direction of the load beam. The tab is shaped in an arc such that a central portion in a lateral direction protrudes with respect to both end portions in the lateral direction, in the load beam. Each of the both end portions includes a flat surface parallel to the lateral direction.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: October 24, 2023
    Assignee: NHK SPRING CO., LTD.
    Inventors: Takumi Karasawa, Naoki Iwamoto, Sei Kawao, Tomoharu Imai
  • Publication number: 20230108526
    Abstract: A disk drive suspension of the embodiments includes a load beam, and a flexure including a mounting portion on which a slider is mounted and overlapping with the load beam. The load beam includes a tab further extending than the mounting portion longitudinal direction of the load beam. The tab is shaped in an arc such that a central portion in a lateral direction protrudes with respect to both end portions in the lateral direction, in the load beam. Each of the both end portions includes a flat surface parallel to the lateral direction.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 6, 2023
    Applicant: NHK SPRING CO., LTD.
    Inventors: Takumi KARASAWA, Naoki IWAMOTO, Sei KAWAO, Tomoharu IMAI
  • Patent number: 9761256
    Abstract: A flexure mounted on a load beam of a disk drive suspension, including a metal base formed of a stainless-steel plate; and a conductive circuit arranged along the metal base. The conductive circuit includes an insulating layer on the metal base; and a conductor on the insulating layer. The conductor includes a thin conductor portion formed in a first region (A1) which is part of the conductive circuit in a longitudinal direction; and a thick conductor portion formed in a second region (A2) which is another part of the conductive circuit in the longitudinal direction, the thick conductor portion being thicker than the thin conductor portion. The flexure includes a flexure tail portion having an opening formed in the metal base; a bent portion of the metal base which is bent in a thickness direction at the opening; and a trace curved portion curved in the thickness direction at a position facing the opening. The trace curved portion includes the thick conductor portion.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: September 12, 2017
    Assignee: NHK SPRING CO., LTD.
    Inventor: Sei Kawao
  • Publication number: 20170236540
    Abstract: A flexure mounted on a load beam of a disk drive suspension, including a metal base formed of a stainless-steel plate; and a conductive circuit arranged along the metal base. The conductive circuit includes an insulating layer on the metal base; and a conductor on the insulating layer. The conductor includes a thin conductor portion formed in a first region (A1) which is part of the conductive circuit in a longitudinal direction; and a thick conductor portion formed in a second region (A2) which is another part of the conductive circuit in the longitudinal direction, the thick conductor portion being thicker than the thin conductor portion. The flexure includes a flexure tail portion having an opening formed in the metal base; a bent portion of the metal base which is bent in a thickness direction at the opening; and a trace curved portion curved in the thickness direction at a position facing the opening. The trace curved portion includes the thick conductor portion.
    Type: Application
    Filed: May 1, 2017
    Publication date: August 17, 2017
    Applicant: NHK SPRING CO., LTD.
    Inventor: Sei KAWAO
  • Patent number: 9721598
    Abstract: A terminal pad of a flexure for a head suspension connected to a functional part through a bonding material includes a terminal body, a base plating formed on a surface of the terminal body and having an uniform thickness, a padding plating made of a same material as the base plating and integrated with the base plating so that the padding plating swells with respect to the base plating, and a surface plating formed on a surface of the padding plating.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: August 1, 2017
    Assignee: NHK Spring Co., Ltd.
    Inventors: Sei Kawao, Yukie Yamada
  • Patent number: 9679592
    Abstract: A suspension includes a load beam and a flexure. The flexure has a metal base and a conductive circuit portion. The conductive circuit portion has an insulating layer formed on the metal base, and a conductor formed on the insulating layer. The conductive circuit portion includes a first region which constitutes a part of the conductive circuit portion in the longitudinal direction, and a second region which constitutes another part of the same in the longitudinal direction. The conductor includes a thin conductor portion having a first thickness arranged in the first region, and a thick conductor portion having a second thickness arranged in the second region. The second thickness is greater than the first thickness.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: June 13, 2017
    Assignee: NHK SPRING CO., LTD.
    Inventor: Sei Kawao
  • Publication number: 20170076745
    Abstract: A suspension includes a load beam and a flexure. The flexure has a metal base and a conductive circuit portion. The conductive circuit portion has an insulating layer formed on the metal base, and a conductor formed on the insulating layer. The conductive circuit portion includes a first region which constitutes a part of the conductive circuit portion in the longitudinal direction, and a second region which constitutes another part of the same in the longitudinal direction. The conductor includes a thin conductor portion having a first thickness arranged in the first region, and a thick conductor portion having a second thickness arranged in the second region. The second thickness is greater than the first thickness.
    Type: Application
    Filed: July 20, 2016
    Publication date: March 16, 2017
    Applicant: NHK SPRING CO., LTD.
    Inventor: Sei KAWAO
  • Patent number: 9396747
    Abstract: An interleave circuit includes a metal base, an insulating layer, a first conductor member having first branch conductors, a second conductor member having second branch conductors, and a jumper conductor, which is a part of the metal base. The jumper conductor includes a branch-side metal portion, a pad-side metal portion, and a bridge portion. The bridge portion is formed between the branch-side metal portion and the pad-side metal portion. The branch-side metal portion electrically conducts to connecting terminals of the first branch conductors via branch-side connecting members. The pad-side metal portion electrically conducts to an electrode pad via a pad-side connecting member. The bridge portion includes a crossover portion which crosses over a third conductor member.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: July 19, 2016
    Assignee: NHK SPRING CO., LTD.
    Inventor: Sei Kawao
  • Patent number: 9368138
    Abstract: In a first terminal portion, a first conductor, a terminal element as a first protection, and a first gold-plating layer are provided. The first terminal element is thicker than a base nickel layer of a slider terminal portion. The first gold-plating layer is provided with a first roughening processed portion. An electrically conductive paste contacts the roughening processed portion. In a second terminal portion, a second conductor, a terminal element as a second protection, and a second gold-plating layer are provided. The second terminal element is thicker than the base nickel layer. The second gold-plating layer is provided with a second roughening processed portion. An electrically conductive paste contacts the second roughening processed portion.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: June 14, 2016
    Assignee: NHK SPRING CO., LTD.
    Inventors: Masaru Inoue, Sei Kawao, Rintarou Niwa
  • Publication number: 20160071533
    Abstract: An interleave circuit includes a metal base, an insulating layer, a first conductor member having first branch conductors, a second conductor member having second branch conductors, and a jumper conductor, which is a part of the metal base. The jumper conductor includes a branch-side metal portion, a pad-side metal portion, and a bridge portion. The bridge portion is formed between the branch-side metal portion and the pad-side metal portion. The branch-side metal portion electrically conducts to connecting terminals of the first branch conductors via branch-side connecting members. The pad-side metal portion electrically conducts to an electrode pad via a pad-side connecting member. The bridge portion includes a crossover portion which crosses over a third conductor member.
    Type: Application
    Filed: August 26, 2015
    Publication date: March 10, 2016
    Applicant: NHK SPRING CO., LTD.
    Inventor: Sei KAWAO
  • Patent number: 9218832
    Abstract: A method of surely removing a read/write slider from a flexure without large displacement of the slider, the slider attached to the flexure of the head suspension through an adhesive, comprises heating the slider so that the adhesive is heated through an adhered surface of the slider being in contact with the adhesive; and applying ultrasonic vibration to the slider so that the adhered surface of the slider vibrates at ultrasonic frequency with respect to the adhesive.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: December 22, 2015
    Assignee: NHK Spring Co., Ltd.
    Inventors: Sei Kawao, Shinpei Kakiuchi
  • Publication number: 20150332715
    Abstract: A terminal pad of a flexure for a head suspension connected to a functional part through a bonding material includes a terminal body, a base plating formed on a surface of the terminal body and having an uniform thickness, a padding plating made of a same material as the base plating and integrated with the base plating so that the padding plating swells with respect to the base plating, and a surface plating formed on a surface of the padding plating.
    Type: Application
    Filed: April 24, 2015
    Publication date: November 19, 2015
    Inventors: Sei KAWAO, Yukie YAMADA
  • Patent number: 9070418
    Abstract: A cutting jig cuts bonding material of a terminal joint between a magnetic head's slider and a flexure's wiring terminal. A base of the jig receives the slider. A blade moves along the base and faces a front side wall of the slider in a moving direction. An upright portion of the jig is formed on the base and has a stop face that faces a rear side wall of the slider in the moving direction. The blade moves toward the slider to come into contact with the bonding material, and is pressed to the front side wall of the slider. The bonding material is interposed in the moving direction while the rear side wall of the slider is brought into contact with and is stopped by the stop face when the slider is set on the base and the bonding material is cut.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: June 30, 2015
    Assignee: NHK Spring Co., Ltd.
    Inventors: Sei Kawao, Takeshi Shimoda, Shinpei Kakiuchi
  • Publication number: 20140368954
    Abstract: In a first terminal portion, a first conductor, a terminal element as a first protection, and a first gold-plating layer are provided. The first terminal element is thicker than a base nickel layer of a slider terminal portion. The first gold-plating layer is provided with a first roughening processed portion. An electrically conductive paste contacts the roughening processed portion. In a second terminal portion, a second conductor, a terminal element as a second protection, and a second gold-plating layer are provided. The second terminal element is thicker than the base nickel layer. The second gold-plating layer is provided with a second roughening processed portion. An electrically conductive paste contacts the second roughening processed portion.
    Type: Application
    Filed: May 7, 2014
    Publication date: December 18, 2014
    Applicant: NHK SPRING CO., LTD.
    Inventors: Masaru INOUE, Sei KAWAO, Rintarou NIWA
  • Patent number: 8752278
    Abstract: A method of reclaiming a head suspension includes detaching a slider 225 from a tongue 221 of the head suspension and removing an adhesive 227 remaining on the tongue 221. Removing the adhesive 227 remaining on the tongue 221 includes feeding a solvent 243, which promotes the removal of the adhesive 227, to a part of the tongue 221 where the adhesive 227 remains and promoting the removal of the remaining adhesive 227 from the tongue 221 by applying physical energy to the adhesive remaining part on the tongue 221. The physical energy is produced by heating, supersonic vibration, and the like. The method easily removes the adhesive 227 from the tongue 221 without directly applying mechanical force to the tongue 221, thereby improving yields.
    Type: Grant
    Filed: May 18, 2009
    Date of Patent: June 17, 2014
    Assignee: NHK Spring Co., Ltd.
    Inventors: Masaru Inoue, Sei Kawao, Takeshi Shimoda
  • Patent number: 8689429
    Abstract: A method of reworking a head suspension removes a slider from the head suspension by pressing a blade from a first side toward a second side in a longitudinal direction of the slider to solder ball bonding, stopping the second side of the slider in the longitudinal direction with a holding mechanism, and forcing the blade to bite and cut the solder ball bonding to remove the slider from the flexure. The solder ball bonding is cut without applying extra force to components of the head suspension except the slider. The method improves product yield.
    Type: Grant
    Filed: July 26, 2010
    Date of Patent: April 8, 2014
    Assignee: NHK Spring Co., Ltd.
    Inventors: Sei Kawao, Takeshi Shimoda, Shinpei Kakiuchi
  • Publication number: 20130291376
    Abstract: A method of surely removing a read/write slider from a flexure without large displacement of the slider, the slider attached to the flexure of the head suspension through an adhesive, comprises heating the slider so that the adhesive is heated through an adhered surface of the slider being in contact with the adhesive; and applying ultrasonic vibration to the slider so that the adhered surface of the slider vibrates at ultrasonic frequency with respect to the adhesive.
    Type: Application
    Filed: April 16, 2013
    Publication date: November 7, 2013
    Applicant: NHK SPRING CO., LTD.
    Inventors: Sei KAWAO, Shinpei KAKIUCHI
  • Publication number: 20110016685
    Abstract: A method of reworking a head suspension removes a slider from the head suspension by pressing a blade from a first side toward a second side in a longitudinal direction of the slider to solder ball bonding, stopping the second side of the slider in the longitudinal direction with a holding mechanism, and forcing the blade to bite and cut the solder ball bonding to remove the slider from the flexure. The solder ball bonding is cut without applying extra force to components of the head suspension except the slider. The method improves product yield.
    Type: Application
    Filed: July 26, 2010
    Publication date: January 27, 2011
    Applicant: NHK SPRING CO., LTD.
    Inventors: Sei KAWAO, Takeshi SHIMODA, Shinpei KAKIUCHI
  • Publication number: 20090303636
    Abstract: A method of reclaiming a head suspension includes detaching a slider 225 from a tongue 221 of the head suspension and removing an adhesive 227 remaining on the tongue 221. Removing the adhesive 227 remaining on the tongue 221 includes feeding a solvent 243, which promotes the removal of the adhesive 227, to a part of the tongue 221 where the adhesive 227 remains and promoting the removal of the remaining adhesive 227 from the tongue 221 by applying physical energy to the adhesive remaining part on the tongue 221. The physical energy is produced by heating, supersonic vibration, and the like. The method easily removes the adhesive 227 from the tongue 221 without directly applying mechanical force to the tongue 221, thereby improving yields.
    Type: Application
    Filed: May 18, 2009
    Publication date: December 10, 2009
    Applicant: NHK Spring Co, Ltd.
    Inventors: Masaru Inoue, Sei Kawao, Tekeshi Shimoda