Patents by Inventor Sei Nakamichi

Sei Nakamichi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Insulating adhesive for multilayer printed circuit board
    Patent number: 5976699
    Abstract: An insulating adhesive for a multilayer printed circuit board, which is to be laminated to an internal layer circuit board coated with an undercoating agent comprising an epoxy resin and a curing agent therefor, and which comprises as essential components:(a) a bisphenol type epoxy resin or phenoxy resin having a weight average molecular weight of at least 10,000,(b) a bisphenol type epoxy resin having an epoxy equivalent of not more than 500, and(c) an epoxy resin curing agent, said insulating adhesive being excellent in storage stability in the form of a varnish or as coated on a copper foil, and when coated on an internal layer circuit board coated with an undercoating agent, being able to be well integrally cured with the undercoating agent.
    Type: Grant
    Filed: October 10, 1996
    Date of Patent: November 2, 1999
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Takeshi Hosomi, Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi, Masahiro Mitsui
  • Process for producing multilayer printed circuit board
    Patent number: 5806177
    Abstract: A process for producing a multilayer printed circuit board which comprises coating a light and heat curable undercoating agent on an internal layer circuit board, irradiating the undercoating agent with active energy beams to make the same tack-free, then laminating thereto a metal foil having an insulating adhesive layer and subsequently heating the resulting assembly to integrally cure the same. When the undercoating agent is coated on an internal layer circuit board and irradiated with a light to be made tack-free, and thereto is laminated a copper foil having a thermosetting insulating adhesive by a rigid roll or the like, the undercoating agent is softened or fluidized and the surface is smoothened. When the resulting laminate is thereafter heated, the undercoating agent coated on the internal layer circuit board and the insulating adhesive coated on the copper foil are integrally cured.
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: September 15, 1998
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Takeshi Hosomi, Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi, Masahiro Mitsui
  • Undercoating agent for multilayer printed circuit board
    Patent number: 5756190
    Abstract: An undercoating agent for a multilayer printed circuit board which comprises:(a) a normally solid epoxy resin having a softening point of 45.degree. to 120.degree. C.,(b) an epoxy resin curing agent,(c) a diluent in which the epoxy resin is dissolved and which consists of a photopolymerizable monomer, and(d) a photopolymerization initiator,said undercoating agent being effectively used in the production of a multilayer printed circuit board which utilizes making the undercoating agent tack-free by irradiation with active energy beams and the main curing of the undercoating agent by heating.
    Type: Grant
    Filed: October 22, 1996
    Date of Patent: May 26, 1998
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Takeshi Hosomi, Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi, Masahiro Mitsui