Abstract: Provided is a stand capable of supporting an electronic device and improving the degree of freedom in appearance of the electronic device. A stand (1) is a stand for supporting an electronic device (90) having a lower exterior panel (92B) with a curved lower surface. The stand (1) has a stand main body (B) that is located, in plan view, inside an outer circumferential edge of the lower exterior panel (92B) and that has supporting surfaces (11a and 11b) to make contact with the lower surface. Also, the stand (1) has an arm (27) that extends from the stand main body (B) toward the outer circumferential edge of the lower exterior panel (92B) of the electronic device (90) and that has engagement sections (27A and 27B) to engage with an exterior member of the electronic device (90).

Abstract: In a structure using a metal having fluidity as a thermally conductive material, the thermally conductive material is prevented from entering an unintended region even in a case where a change in attitude of a semiconductor device or vibration occurs. An electronic apparatus has a thermally conductive material (31) formed between a radiator (50) and a semiconductor chip (11). The thermally conductive material (31) has fluidity at least at a time of operation of the semiconductor chip (11). In addition, the thermally conductive material (31) has electric conductivity. The thermally conductive material (31) is surrounded by a seal member (33). A capacitor (16) is covered by an insulating portion (15).