Abstract: A street illuminating device includes a retaining frame, a light source module, and a heat dissipating module. The light source module includes a printed circuit board retained in the retaining frame, a number of solid state lighting elements, and a light reflecting plate. The printed circuit board has a first surface and an opposite second surface. The solid state lighting elements are arranged on the first surface of the printed circuit board. The light reflecting plate includes a number of through holes with inner reflecting surfaces. The light reflecting plate is disposed on the first surface of the printed circuit board with the solid state lighting elements received in the respective through holes. The heat dissipating module is in thermal contact with the second surface of the printed circuit board.

Abstract: An apparatus for manufacturing optical elements at wafer level includes a lower mold core, an upper mold core, an aligning plate and an image pick-up device. The lower mold core has a lower alignment mark. The upper mold core has an upper alignment mark. The aligning plate has a first middle alignment mark corresponding to the lower alignment mark and a second middle alignment mark corresponding to the upper alignment mark. The image pick-up device is configured for capturing and analyzing images of the alignment marks to align the lower mold core, the aligning plate and the upper mold core.

Abstract: An exemplary lens includes a light pervious substrate, a first optically active part, and a light blocking film. The light pervious substrate has a first surface, an opposite second surface, and a recess defined in the first surface. The recess includes a bottom surface. The first optically active part is formed on the bottom surface. The light blocking film is formed on the bottom surface surrounding the first optically active part.

Abstract: An illumination device includes a lampshade, a heat dissipation module, a light module and a lamp cap. The lampshade includes a shell and an optical lens fixed on the shell. The heat dissipation module includes a plurality of heat sinks, a bottom plate coupled to the heat sinks, and a cavity defined in the center of the heat dissipation module. The light module is received in the cavity and toward the optical lens, including a substrate and a light source mounted on the substrate. The lamp cap is coupled to the heat dissipation module and away from the optical lens.

Abstract: An exemplary light emitting diode (LED) streetlight includes an LED light source and a heat dissipating module. The LED light source includes a circuit board and a plurality of LEDs. The circuit board has a first surface and a second surface. The LEDs are disposed on the first surface and electrically connected to the circuit board. The heat dissipating module includes a heat conducting plate, a plurality of heat pipes containing a working liquid and a plurality of fins. The heat conducting plate has a bonding surface and a heat dissipating surface opposite to the bonding surface. Each heat pipe has a heated section thermally connected to the heat dissipating surface and a condensing section spaced from the heat dissipating plate and penetrate into the plurality of fins. The circuit board is fixed on the bonding surface of the heat conducting plate.

Abstract: A method for measuring illuminance of a lamp utilizes at least one illuminance meter and a rotary apparatus. The lamp is installed on the rotary apparatus. The lamp emits light and projects onto an irradiation area. A measurement area is defined from within the irradiation area. The measurement area is evenly divided into n sub-measurement areas, wherein n is a natural number. The n sub-measurement areas are centrosymmetric. At least one illuminance meter measuring illuminance of the lamp is disposed on one of the n sub-measurement areas. The rotary apparatus drives the lamp to rotate 360/n° in turn. The single illuminance meter measures illuminance of the lamp in other (n-1) sub-measurement areas.

Abstract: An exemplary method for fabricating a mold core includes the following steps. First, a substrate is provided. Second, a photo resist layer is formed on the substrate, the photo resist layer has a top surface. Third, the photo resist layer is etched using a direct writing process to form the top surface thereof into a substantially aspherical stepped surface. Lastly, the photo resist layer is softened using a reflow process to transform the substantially aspherical stepped surface into a substantially aspherical smooth molding surface. Thereby, a mold core having the substantially aspherical smooth molding surface is obtained.

Abstract: An exemplary method for fabricating a mold core includes the following steps. First, a substrate is provided. Second, a photo resist layer is formed on the substrate, the photo resist layer has a top surface. Third, the photo resist layer is etched using a direct writing process to form the top surface thereof into a substantially aspherical stepped surface. Lastly, the photo resist layer is softened using a reflow process to transform the substantially aspherical stepped surface into a substantially aspherical smooth molding surface. Thereby, a mold core having the substantially aspherical smooth molding surface is obtained.

Abstract: A method for making an optical article having a first optical surface and an opposite second optical surface, is provided. The method includes: providing a transparent substrate having a first surface and an opposite second surface; forming a first layer comprised of a first molding material on the first surface of the substrate; press-molding the first layer to form a first optical surface thereon; providing a supporting mold having a supporting surface conforming to the first optical surface; attaching the supporting mold to the first layer with the first optical surface in intimate contact with the supporting surface thereof; forming a second layer comprised of a second molding material on the second surface of the substrate; press-molding the second layer to form a second optical surface thereon; and removing the supporting mold to obtain an optical article including the substrate with the first and second layers at opposite sides thereof.

Abstract: A street illuminating device includes a retaining frame, a light source module, and a heat dissipating module. The light source module includes a printed circuit board retained in the retaining frame, a number of solid state lighting elements, and a light reflecting plate. The printed circuit board has a first surface and an opposite second surface. The solid state lighting elements are arranged on the first surface of the printed circuit board. The light reflecting plate includes a number of through holes with inner reflecting surfaces. The light reflecting plate is disposed on the first surface of the printed circuit board with the solid state lighting elements received in the respective through holes. The heat dissipating module is in thermal contact with the second surface of the printed circuit board.

Abstract: A method for manufacturing a mold used in impression process is provided. The method includes the following steps: forming a negative photoresist layer between a transparent substrate and a supporting substrate; exposing the negative photoresist layer via the transparent substrate by direct writing technology; removing the supporting substrate; and developing the negative photoresist layer to form the mold.

Abstract: A grinding apparatus for grinding at least one workpiece includes a base, a first pressing portion, and a second pressing portion. The base is configured for receiving the workpiece. The first pressing portion and a second pressing portion are configured for applying a pressing force against the workpiece cooperatively, so as to hold the workpiece between the first pressing portion and the second pressing portion. The first pressing portion and the second pressing portion are moveable and rotatable relative to the base for removing the workpiece apart from the base and rotating the workpiece clockwise and counter-clockwise. A grinding method is also provided.

Abstract: A sputtering system carrier configured for supporting a workpiece comprises a main body and a supporting body. The main body includes four end to end frames, which are a first frame, a second frame, a third frame, and a fourth frame. The first frame and the third frame each have a sliding slot. The second frame and the fourth frame each has a coil wrapped around the frame. The supporting body includes four end to end frames, which are a fifth frame, a sixth frame, a seventh frame, and an eighth frame. The fifth frame and the seventh frame have a pivot protruding from outside surface. The pivots are movably held in the sliding slots. The pivots are positioned either near the sixth frame or the eighth frame. The sixth frame, the eighth frame, or both have a magnet.