Patents by Inventor Seichi Okamura

Seichi Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interface detection apparatus and method for detecting hidden interface using microwave
    Patent number: 7367226
    Abstract: An interface detection apparatus detects a position of a hidden interface between first and second materials, the first material having a different physical property from the second material. The apparatus encompasses (a) an irradiation mechanism configured to irradiate an electromagnetic wave onto a sample implemented by the first and second materials, (b) a detection mechanism configured to detect the electromagnetic wave that has passed through the sample, and (c) a traveling mechanism configured to change the relative position of the hidden interface with respect to the position of the detection mechanism.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: May 6, 2008
    Assignee: President of Shizuoka University
    Inventor: Seichi Okamura
  • Sensor system for moisture and salt measurement using microstripline
    Publication number: 20060220658
    Abstract: A method for measuring moisture content and salt concentration contained in soil is provided. It is based on an idea of using a ratio of microwave signals propagating through a microstripline. Using the microwaves at 2 GHz and 10 GHz, the measurement is carried out on a sample of sand. Although the measurement result has non-negligible error, it confirms that the sensor has an ability of measuring the moisture content and salt concentration.
    Type: Application
    Filed: March 30, 2006
    Publication date: October 5, 2006
    Inventor: Seichi Okamura
  • Interface detection apparatus and method for detecting hidden interface using microwave
    Publication number: 20050156607
    Abstract: An interface detection apparatus detects a position of a hidden interface between first and second materials, the first material having a different physical property from the second material. The apparatus encompasses (a) an irradiation mechanism configured to irradiate an electromagnetic wave onto a sample implemented by the first and second materials, (b) a detection mechanism configured to detect the electromagnetic wave that has passed through the sample, and (c) a traveling mechanism configured to change the relative position of the hidden interface with respect to the position of the detection mechanism.
    Type: Application
    Filed: March 31, 2004
    Publication date: July 21, 2005
    Applicant: President of Shizuoka University
    Inventor: Seichi Okamura