Patents by Inventor Seid H. Sadat

Seid H. Sadat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interposer for multi-chip electronics packaging
    Patent number: 10615111
    Abstract: An interposer for vertically separating device die is disclosed. The interposer includes a compliant layer comprising a plurality of thermally conductive plugs that are physically disconnected within the plane of the compliant layer, where the space between the plugs is filled with a compliant medium. In some embodiments, at least one of the top and bottom surfaces of the compliant layer is coated with a thin layer of electrically insulating material.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: April 7, 2020
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Arunava Majumdar, Seid H. Sadat, Dusan Coso
  • INTERPOSER FOR MULTI-CHIP ELECTRONICS PACKAGING
    Publication number: 20160126159
    Abstract: An interposer for vertically separating device die is disclosed. The interposer includes a compliant layer comprising a plurality of thermally conductive plugs that are physically disconnected within the plane of the compliant layer, where the space between the plugs is filled with a compliant medium. In some embodiments, at least one of the top and bottom surfaces of the compliant layer is coated with a thin layer of electrically insulating material.
    Type: Application
    Filed: November 2, 2015
    Publication date: May 5, 2016
    Inventors: Arunava Majumdar, Seid H. Sadat, Dusan Coso