Patents by Inventor Seigo MORISHITA

Seigo MORISHITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN MOLDED ARTICLE
    Publication number: 20220339833
    Abstract: A resin molded article includes: a main body portion having a design face and an opposite face thereto, and having a first foamed layer formed inside the main body portion; a protruding portion that is provided at an edge portion of the main body portion, and that protrudes toward a side opposite from the design face in a thickness direction of the main body portion; and a concavity that is recessed from a surface of the opposite face toward a thickness direction side of the main body portion at a root portion of the protruding portion at the opposite face.
    Type: Application
    Filed: October 7, 2020
    Publication date: October 27, 2022
    Applicant: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Kouji YAMADA, Shingo NAKANO, Naoko MITSUISHI, Seigo MORISHITA, Hiroyuki ANDO, Yoji HIRAI