Abstract: According to one embodiment, an optical module includes a light emitting device, a driver IC, a first lead, a ground lead, a second lead, an input lead, and a power supply voltage lead. A second electrode of the light emitting device is supplied with a voltage on a ground side from a second pad through the first lead. A first electrode is supplied with a voltage on a power supply side from the power supply voltage lead or from a first pad through the second lead.

Abstract: According to one embodiment, an optical module includes a light emitting device, a driver IC, a first lead, a ground lead, a second lead, an input lead, and a power supply voltage lead. A second electrode of the light emitting device is supplied with a voltage on a ground side from a second pad through the first lead. A first electrode is supplied with a voltage on a power supply side from the power supply voltage lead or from a first pad through the second lead.

Abstract: An optical semiconductor device comprising: an internal lead; an optical semiconductor element mounted on the internal lead and electrically connected to the internal lead; a sealing resin for sealing the optical semiconductor element and the internal lead, the sealing resign provided with an attachment hole formed by side surfaces and a bottom surface, the side surfaces each including a convex curved-surface section in an upper portion and a planar-surface section in a lower portion contiguous to the curved-surface section, and the bottom surface being in a lower portion and facing the front surface of a functional region for emitting or receiving light of the optical semiconductor element, and the sealing resin being transparent to outgoing or incoming light; and an external terminal connected to the internal lead and adapted for surface mount.