Patents by Inventor Seigo Ooiwa

Seigo Ooiwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating ceramic multilayer substrate
    Patent number: 6042667
    Abstract: A method of fabricating a ceramic multilayer substrate includes steps of laminating a plurality of green sheets including an inside green sheet formed with a conductor pattern and pressing a laminate of green sheets under a predetermined pressure together with sheet restricting members applied to opposite surfaces of the laminate respectively, thereby bonding the laminate and sheet restricting members together, each sheet restricting member having a smaller percent change in thickness than the green sheets during the bonding and a higher firing temperature than the green sheets, firing a bonded assemblage of the green sheets and sheet restricting members at a firing temperature of the green sheets, and removing the sheet restricting members from the opposite surfaces of a fired body.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: March 28, 2000
    Assignee: Sumotomo Metal Electronics Devices, Inc.
    Inventors: Satoru Adachi, Junzo Fukuta, Katsuya Kawakami, Seigo Ooiwa