Patents by Inventor Seigo Yokochi

Seigo Yokochi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130333744
    Abstract: Provided is a conductive adhesive composition including: conductive particles (A) containing metal having a melting point of equal to or lower than 210° C.; a resin (B) having a softening point of equal to or lower than the melting point of the metal of the conductive particles and being solid at a room temperature; a flux activator (C); and a solvent (D).
    Type: Application
    Filed: January 11, 2012
    Publication date: December 19, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Seigo Yokochi, Masaru Fujita, Hiroki Hayashi
  • Publication number: 20130319499
    Abstract: Provided is a conductive adhesive composition which contains conductive particles (A) containing metal having a melting point of equal to or lower than 210° C., a thermosetting resin (B), and a flux activator (C), in which viscosity of the conductive adhesive composition is 5 to 30 Pa·s, and a content of the conductive particles (A) is 70 to 90% by mass with respect to the total amount of the conductive adhesive composition.
    Type: Application
    Filed: September 30, 2011
    Publication date: December 5, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Seigo Yokochi, Hiroki Hayashi