Patents by Inventor Seigou Takuwa

Seigou Takuwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same
    Patent number: 7986050
    Abstract: The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C): (A) an epoxy resin represented by the following structural formula (1): in which n is a positive number, (B) an epoxy resin except for the epoxy resin represented by the structural formula (1), and (C) a curing agent.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: July 26, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Shinya Ota, Kazuhiro Fuke, Chisato Goto, Hisataka Ito, Takashi Taniguchi, Kazuhiko Yoshida, Masao Gunji, Seigou Takuwa
  • EPOXY RESIN COMPOSITION
    Publication number: 20100184923
    Abstract: An epoxy resin composition comprising, containing a solid epoxy resin (A) whose aromatic ring containing ratio is 5-40% obtained by reacting a polyester compound (b) possessing 1.2-1.8 of carboxylic group with a divalent epoxy resin (a) whose epoxy equivalent is 120-350 g/eq and a crosslinking agent (B) as essential components, and since a cured product obtained by curing said composition is superior in heat resistance, humid resistance and cracking resistance, said composition is useful in a field of electron material such as photo semi conductor sealing material, in particular useful for LED sealing.
    Type: Application
    Filed: June 12, 2008
    Publication date: July 22, 2010
    Inventors: Kazuhiko Yoshida, Masao Gunji, Seigou Takuwa
  • EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20100019271
    Abstract: The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C): (A) an epoxy resin represented by the following structural formula (1): in which n is a positive number, (B) an epoxy resin except for the epoxy resin represented by the structural formula (1), and (C) a curing agent.
    Type: Application
    Filed: July 27, 2009
    Publication date: January 28, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinya OTA, Kazuhiro FUKE, Chisato GOTO, Hisataka ITO, Takashi TANIGUCHI, Kazuhiko YOSHIDA, Masao GUNJI, Seigou TAKUWA