Patents by Inventor Seiichi Bamba

Seiichi Bamba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating MMIC semiconductor integrated circuits using the RF and DC measurements of an active device on a substrate to design the passive elements, which are then E-beam written to the substrate
    Patent number: 5051373
    Abstract: An active device such as an HEMT is formed on a GaAs substrate, and characteristics of this active device formed are measured. A circuit pattern of a passive circuit device including a serial microstrip line is simulated on the basis of the results of this measurement, and a circuit pattern obtained by the simulation is directly drawn on a substrate to form the passive circuit device, thereby to fabricate an MMIC. Accordingly, the passive circuit device is formed in conformity with the characteristics of the active device for each chip.As a result, the variation in characteristics of the active device is canceled, to obtain an MMIC superior in matching.
    Type: Grant
    Filed: January 5, 1990
    Date of Patent: September 24, 1991
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Takashi Yamada, Akihito Nagamatsu, Seiichi Bamba, Tetsuro Sawai, Haruo Nakano, Kimihiko Nagami