Patents by Inventor Seiichi Ishikawa

Seiichi Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9805998
    Abstract: The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.
    Type: Grant
    Filed: May 15, 2013
    Date of Patent: October 31, 2017
    Assignee: Namics Corporation
    Inventors: Seiichi Ishikawa, Haruyuki Yoshii, Kazuyuki Kohara
  • Patent number: 9748158
    Abstract: A liquid sealing material which has excellent PCT (pressure cooker test) resistance, and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and the boron content in the silica filler (C) has an average of 1-50 ppm.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: August 29, 2017
    Assignee: NAMICS CORPORATION
    Inventors: Seiichi Ishikawa, Haruyuki Yoshii, Kazuyuki Kohara
  • Publication number: 20160300772
    Abstract: A liquid sealing material which has excellent PCT (pressure cooker test) resistance, and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and the boron content in the silica filler (C) has an average of 1-50 ppm.
    Type: Application
    Filed: June 23, 2016
    Publication date: October 13, 2016
    Inventors: Seiichi ISHIKAWA, Haruyuki YOSHII, Kazuyuki KOHARA
  • Publication number: 20150175856
    Abstract: The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.
    Type: Application
    Filed: May 15, 2013
    Publication date: June 25, 2015
    Inventors: Seiichi Ishikawa, Haruyuki Yoshii, Kazuyuki Kohara
  • Patent number: 8981233
    Abstract: A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, and the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: March 17, 2015
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Takeshi Sakurai, Seiichi Ishikawa, Kenji Kubota, Takashi Tamagawa
  • Publication number: 20140134457
    Abstract: A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, and the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5.
    Type: Application
    Filed: January 23, 2014
    Publication date: May 15, 2014
    Applicant: MITSUBISHI SHINDOH CO., LTD.
    Inventors: Takeshi Sakurai, Seiichi Ishikawa, Kenji Kubota, Takashi Tamagawa
  • Patent number: 8698002
    Abstract: A Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5, and the average thickness of the Cu3Sn layer is 0.01 ?m to 0.5 ?m.
    Type: Grant
    Filed: July 9, 2009
    Date of Patent: April 15, 2014
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Takeshi Sakurai, Seiichi Ishikawa, Kenji Kubota, Takashi Tamagawa
  • Patent number: 8586467
    Abstract: In flip chip attach of electronic components, underfill is filled between the component and the substrate to alleviate, for example, thermal stress. In electronic component mounting using copper pillars conducted so far, filler contained in the underfill may cause separation in the process of heating and curing the resin. Disclosed is plating the surfaces of the copper pillars with solder. Mobilization of the filler charged in the underfill due to electric fields produced by local cells that are developed upon contact between dissimilar metals, is suppressed, and occurrence of crack at connection portions is obviated. Thus, connection reliability is increased.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: November 19, 2013
    Assignee: Namics Corporation
    Inventors: Osamu Suzuki, Seiichi Ishikawa, Haruyuki Yoshii
  • Patent number: 8499925
    Abstract: A conveying roller facilitates conveyance of a sticky material in the form of sheet or web to be conveyed. An outer peripheral layer of the convey roller is formed on its rolling surface with a plurality of pits at a predetermined occupancy ratio defined by an occupancy ratio of a total area occupied by all of the pits to an area of the rolling surface of the outer peripheral layer. The outer peripheral layer is formed on the rolling surface thereof with a plurality of pits at the occupancy ratio set depending on a degree of stickiness expressed by the sheet material to achieve peel properties of the outer peripheral layer which is compatible with the stickiness of the sheet material and thereby to prevent the sticky sheet material from twining around the conveying roller.
    Type: Grant
    Filed: September 17, 2009
    Date of Patent: August 6, 2013
    Assignee: Uni-Charm Corporation
    Inventors: Shigeru Arimoto, Seiichi Ishikawa
  • Publication number: 20110316149
    Abstract: In flip chip attach of electronic components, underfill is filled between the component and the substrate to alleviate, for example, thermal stress. In electronic component mounting using copper pillars conducted so far, filler contained in the underfill may cause separation in the process of heating and curing the resin. Disclosed is plating the surfaces of the copper pillars with solder. Mobilization of the filler charged in the underfill due to electric fields produced by local cells that are developed upon contact between dissimilar metals, is suppressed, and occurrence of crack at connection portions is obviated. Thus, connection reliability is increased.
    Type: Application
    Filed: February 25, 2010
    Publication date: December 29, 2011
    Inventors: Osamu Suzuki, Seiichi Ishikawa, Haruyuki Yoshii
  • Publication number: 20110266035
    Abstract: [Object] To provide a conductive member which has a stable contact resistance, is difficult to be separated, and also decreases the inserting and drawing force when used for a connector. [Means to Solve Problems] A Cu—Sn intermetallic compound layer 3 and an Sn-based surface layer 4 are formed in this order on the surface of a Cu-based substrate 1 through an Ni-based base layer 2, and, furthermore, the Cu—Sn intermetallic compound layer 3 is composed of a Cu3Sn layer 5 arranged on the Ni-based base layer 2 and a Cu6Sn5 layer 6 arranged on the Cu3Sn layer 5; the Cu—Sn intermetallic compound layer 3 obtained by bonding the Cu3Sn layer 5 and the Cu6Sn5 layer 6 is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer 4; thicknesses X of the recessed portions 7 are set to 0.05 ?m to 1.
    Type: Application
    Filed: July 9, 2009
    Publication date: November 3, 2011
    Applicant: MITSUBISHI SHINDOH CO., LTD.
    Inventors: Takeshi Sakurai, Seiichi Ishikawa, Kenji Kubota, Takashi Tamagawa
  • Publication number: 20110168521
    Abstract: A conveying roller facilitates conveyance of a sticky material in the form of sheet or web to be conveyed. An outer peripheral layer of the convey roller is formed on its rolling surface with a plurality of pits at a predetermined occupancy ratio defined by an occupancy ratio of a total area occupied by all of the pits to an area of the rolling surface of the outer peripheral layer. The outer peripheral layer is formed on the rolling surface thereof with a plurality of pits at the occupancy ratio set depending on a degree of stickiness expressed by the sheet material to achieve peel properties of the outer peripheral layer which is compatible with the stickiness of the sheet material and thereby to prevent the sticky sheet material from twining around the conveying roller.
    Type: Application
    Filed: September 17, 2009
    Publication date: July 14, 2011
    Applicant: UNI-CHARM CORPORATION
    Inventors: Shigeru Arimoto, Seiichi Ishikawa
  • Publication number: 20040101787
    Abstract: There is provided a method of forming a fine resist pattern in which a highly practicable photo-sensitive composition obtained from a material having a high transparency against an exposure light having a short wavelength such as F2 excimer laser beam is used as a resist, and the method of forming a fine resist pattern comprises a step for forming a photo-sensitive layer on a substrate or on a given layer on a substrate using a photo-sensitive composition comprising at least a compound generating an acid by irradiation of light and a compound having fluorine atom in its molecular structure, a step for exposing by selectively irradiating a given area of said photo-sensitive layer with energy ray, a step for heat-treating the exposed photo-sensitive layer, and a step for forming a fine pattern by developing the heat-treated photo-sensitive layer to selectively remove the exposed portion or un-exposed portion of the photo-sensitive layer.
    Type: Application
    Filed: September 8, 2003
    Publication date: May 27, 2004
    Inventors: Takuya Naito, Seiichi Ishikawa, Minoru Toriumi, Seiro Miyoshi, Tamio Yamazaki, Manabu Watanabe, Toshiro Itani, Takayuki Araki, Meiten Koh
  • Patent number: 6354763
    Abstract: A pumping pant which is more compact in size and has reduced total costs required for construction work of the pumping plant and associated civil engineering works and has a shorter term of the entire construction work includes a pump building which is constructed in its entirely as an island-type building in the form of an island in a suction pond serving as a pump well, whereby the need to refill earth and sand around the pump building is eliminated, and the cost of associated civil engineering works is reduced. Water is sucked from all sidewalls of the pump building, and pumps are arranged within the pump building in at least two rows, resulting in a reduced length of the building. Horizontal portions of a suction pipe and a delivery pipe are extended from the pump in the same direction to reduce a width of the building and to make it compact. A total cost required for the construction of the pump building and associated civil engineering works can be thus reduced.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: March 12, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Seiichi Ishikawa, Shizuichi Sakamoto, Tsuyoshi Yoshida, Saburou Maru, Stefan Emsmann, Hans Pitz
  • Patent number: 6005671
    Abstract: A facsimile system according to the present invention comprises a job control section, a multiple message transmission object specifying section, a multiple message transmission multiplex access instructing section and a multiple message transmission multiplex access processing section, and the job control section determines whether any transmission file has been specified as an object for multiple message transmission and also a multiplex access instruction has been issued or not, and when a multiplex access instruction has not been issued, the job control section reads out transmission files having been specified as objects for multiple message transmission and continuously transmits the files in succession to the transmission file currently being transmitted, and when the multiplex access instruction has been issued, the job control section reads out transmissions files having been specified as objects for multiple message transmission, by means of multiplex access, and continuously transmits the transmiss
    Type: Grant
    Filed: December 19, 1997
    Date of Patent: December 21, 1999
    Assignee: Ricoh Company, Ltd.
    Inventor: Seiichi Ishikawa
  • Patent number: 5636034
    Abstract: A transmitting/receiving unit performs a plurality of data transmission operations and data reception operations in parallel via a plurality of data communication lines. A mode selecting unit is used for a user to select one of a line specifying mode and a free-line searching mode. A line determining unit determines a transmission line from among the plurality of data communication lines, the transmission line being then used for performing a data transmission operation by the transmitting/receiving unit. The line determining unit determines the transmission line as being a line selected by a user from among the plurality of data communication lines when the line specifying mode is selected through the mode selecting unit. The line determining unit searches the plurality of data communication lines for a free one so as to determine the transmission line as being the free one when the free-line searching mode is selected through the mode selecting unit.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: June 3, 1997
    Assignee: Ricoh Company, Ltd.
    Inventor: Seiichi Ishikawa
  • Patent number: 5073946
    Abstract: A speaker which is thin but which is capable of providing high-fidelity reproduction and ensuring a suitable level of sound pressure even when it is brought close to a wall. A closed chamber is formed behind one part of a disphragm mounted in an enclosure, and an open chamber is formed behind another part of the diaphragm. At least one voice coil driver unit is connected to the diaphragm. The phase difference between sounds radiated from the front and rear surfaces of the diaphragm is increased as large as possible by using an acoustic duct for the sound radiated through the open chamber, thereby minimizing cancellation of sounds and improving the sound pressure level.
    Type: Grant
    Filed: November 28, 1989
    Date of Patent: December 17, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Katsuaki Satoh, Kazue Sato, Kousaku Murata, Tsuneo Tanaka, Shuji Saiki, Satoshi Takayama, Hiroyuki Takewa, Mitsuhiko Serikawa, Seiichi Ishikawa, Sawako Usuki, Yoichi Kimura, Shuichi Obata
  • Patent number: 5051942
    Abstract: A transfer function is determined in accordance with an amplitude characteristic and a phase characteristic. The transfer function is subjected to inverse Fourier transform. An imaginary part of a result of the inverse Fourier transform is set to zero and thereby the result of the inverse Fourier transform is converted into a converted result. The converted result is subjected to Fourier transform. The amplitude characteristic and the phase characteristic are updated in accordance with a result of the Fourier transform. Such processes are reiterated. A primary desired amplitude characteristic is corrected in accordance with the finally-obtained amplitude characteristic so that the primary desired amplitude characteristic is converted into a final desired amplitude characteristic. A final desired phase characteristic is determined in accordance with the finally-obtained phase characteristic.
    Type: Grant
    Filed: December 15, 1988
    Date of Patent: September 24, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masaharu Matsumoto, Seiichi Ishikawa, Katsuaki Satoh
  • Patent number: 5023913
    Abstract: An apparatus for changing a sound field, comprising at least two signal processing means, which can smoothly and continuously switch a sound field into an arbitrary sound field without a break of signals by alternately switching one of the signal processing means into the other.
    Type: Grant
    Filed: May 26, 1989
    Date of Patent: June 11, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masaharu Matsumoto, Katsuaki Satoh, Seiichi Ishikawa, Mitsuhiko Serikawa, Akihisa Kawamura, Hikari Hashimoto
  • Patent number: 4899390
    Abstract: A speaker which is thin but which is capable of providing high-fidelity reproduction and ensuring a suitable level of sound pressure even when it is brought close to a wall. A closed chamber is formed behind one part of a diaphragm mounted in an enclosure, and an open chamber is formed behind another part of the diaphragm. At least one voice coil drive unit is connected to the diaphragm. The phase difference between sounds radiated from the front and rear surfaces of the diaphragm is increased as large as possible by using an acoustic duct for the sound radiated through the open chamber, thereby minimizing cancellation of sounds and improving the sound pressure level.
    Type: Grant
    Filed: September 15, 1987
    Date of Patent: February 6, 1990
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroyuki Takewa, Mitsuhiko Serikawa, Seiichi Ishikawa, Sawako Usuki, Yoichi Kimura, Shuichi Obata