Abstract: A terminal material having a base material in which at least a surface is made of Cu or Cu alloy; an Ni layer with at thickness of 0.1 ?m to 1.0 ?m inclusive on the base material; a Cu—Sn intermetallic compound layer with a thickness of 0.2 ?m to 2.5 ?m inclusive on the Ni layer; and an Sn layer with a thickness of 0.5 ?m to 3.0 ?m inclusive on the Cu—Sn intermetallic compound layer, when cross sections of the Cu—Sn intermetallic compound layer and the Sn layer are analyzed by the EBSD method with a measuring step 0.1 ?m and a boundary in which misorientation between adjacent pixels is 2° or more is deemed to be a crystal boundary, an average crystal grain size Dc of the Cu—Sn intermetallic compound layer is 0.5 ?m or more, and a grain size ratio Ds/Dc is five or less.

Abstract: A terminal material having a base material in which at least a surface is made of Cu or Cu alloy; an Ni layer with at thickness of 0.1 ?m to 1.0 ?m inclusive on the base material; a Cu—Sn intermetallic compound layer with a thickness of 0.2 ?m to 2.5 ?m inclusive on the Ni layer; and an Sn layer with a thickness of 0.5 ?m to 3.0 ?m inclusive on the Cu—Sn intermetallic compound layer, when cross sections of the Cu—Sn intermetallic compound layer and the Sn layer are analyzed by the EBSD method with a measuring step 0.1 ?m and a boundary in which misorientation between adjacent pixels is 2° or more is deemed to be a crystal boundary, an average crystal grain size Dc of the Cu—Sn intermetallic compound layer is 0.5 ?m or more, and a grain size ratio Ds/Dc is five or less.

Abstract: The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.

Abstract: A liquid sealing material which has excellent PCT (pressure cooker test) resistance, and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and the boron content in the silica filler (C) has an average of 1-50 ppm.

Abstract: A liquid sealing material which has excellent PCT (pressure cooker test) resistance, and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and the boron content in the silica filler (C) has an average of 1-50 ppm.

Abstract: The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.

Abstract: A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, and the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5.

Abstract: A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, and the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5.

Abstract: A Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5, and the average thickness of the Cu3Sn layer is 0.01 ?m to 0.5 ?m.

Abstract: In flip chip attach of electronic components, underfill is filled between the component and the substrate to alleviate, for example, thermal stress. In electronic component mounting using copper pillars conducted so far, filler contained in the underfill may cause separation in the process of heating and curing the resin. Disclosed is plating the surfaces of the copper pillars with solder. Mobilization of the filler charged in the underfill due to electric fields produced by local cells that are developed upon contact between dissimilar metals, is suppressed, and occurrence of crack at connection portions is obviated. Thus, connection reliability is increased.

Abstract: A conveying roller facilitates conveyance of a sticky material in the form of sheet or web to be conveyed. An outer peripheral layer of the convey roller is formed on its rolling surface with a plurality of pits at a predetermined occupancy ratio defined by an occupancy ratio of a total area occupied by all of the pits to an area of the rolling surface of the outer peripheral layer. The outer peripheral layer is formed on the rolling surface thereof with a plurality of pits at the occupancy ratio set depending on a degree of stickiness expressed by the sheet material to achieve peel properties of the outer peripheral layer which is compatible with the stickiness of the sheet material and thereby to prevent the sticky sheet material from twining around the conveying roller.

Abstract: In flip chip attach of electronic components, underfill is filled between the component and the substrate to alleviate, for example, thermal stress. In electronic component mounting using copper pillars conducted so far, filler contained in the underfill may cause separation in the process of heating and curing the resin. Disclosed is plating the surfaces of the copper pillars with solder. Mobilization of the filler charged in the underfill due to electric fields produced by local cells that are developed upon contact between dissimilar metals, is suppressed, and occurrence of crack at connection portions is obviated. Thus, connection reliability is increased.

Abstract: [Object] To provide a conductive member which has a stable contact resistance, is difficult to be separated, and also decreases the inserting and drawing force when used for a connector. [Means to Solve Problems] A Cu—Sn intermetallic compound layer 3 and an Sn-based surface layer 4 are formed in this order on the surface of a Cu-based substrate 1 through an Ni-based base layer 2, and, furthermore, the Cu—Sn intermetallic compound layer 3 is composed of a Cu3Sn layer 5 arranged on the Ni-based base layer 2 and a Cu6Sn5 layer 6 arranged on the Cu3Sn layer 5; the Cu—Sn intermetallic compound layer 3 obtained by bonding the Cu3Sn layer 5 and the Cu6Sn5 layer 6 is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer 4; thicknesses X of the recessed portions 7 are set to 0.05 ?m to 1.

Abstract: A conveying roller facilitates conveyance of a sticky material in the form of sheet or web to be conveyed. An outer peripheral layer of the convey roller is formed on its rolling surface with a plurality of pits at a predetermined occupancy ratio defined by an occupancy ratio of a total area occupied by all of the pits to an area of the rolling surface of the outer peripheral layer. The outer peripheral layer is formed on the rolling surface thereof with a plurality of pits at the occupancy ratio set depending on a degree of stickiness expressed by the sheet material to achieve peel properties of the outer peripheral layer which is compatible with the stickiness of the sheet material and thereby to prevent the sticky sheet material from twining around the conveying roller.

Abstract: There is provided a method of forming a fine resist pattern in which a highly practicable photo-sensitive composition obtained from a material having a high transparency against an exposure light having a short wavelength such as F2 excimer laser beam is used as a resist, and the method of forming a fine resist pattern comprises a step for forming a photo-sensitive layer on a substrate or on a given layer on a substrate using a photo-sensitive composition comprising at least a compound generating an acid by irradiation of light and a compound having fluorine atom in its molecular structure, a step for exposing by selectively irradiating a given area of said photo-sensitive layer with energy ray, a step for heat-treating the exposed photo-sensitive layer, and a step for forming a fine pattern by developing the heat-treated photo-sensitive layer to selectively remove the exposed portion or un-exposed portion of the photo-sensitive layer.

Abstract: A pumping pant which is more compact in size and has reduced total costs required for construction work of the pumping plant and associated civil engineering works and has a shorter term of the entire construction work includes a pump building which is constructed in its entirely as an island-type building in the form of an island in a suction pond serving as a pump well, whereby the need to refill earth and sand around the pump building is eliminated, and the cost of associated civil engineering works is reduced. Water is sucked from all sidewalls of the pump building, and pumps are arranged within the pump building in at least two rows, resulting in a reduced length of the building. Horizontal portions of a suction pipe and a delivery pipe are extended from the pump in the same direction to reduce a width of the building and to make it compact. A total cost required for the construction of the pump building and associated civil engineering works can be thus reduced.

Abstract: A facsimile system according to the present invention comprises a job control section, a multiple message transmission object specifying section, a multiple message transmission multiplex access instructing section and a multiple message transmission multiplex access processing section, and the job control section determines whether any transmission file has been specified as an object for multiple message transmission and also a multiplex access instruction has been issued or not, and when a multiplex access instruction has not been issued, the job control section reads out transmission files having been specified as objects for multiple message transmission and continuously transmits the files in succession to the transmission file currently being transmitted, and when the multiplex access instruction has been issued, the job control section reads out transmissions files having been specified as objects for multiple message transmission, by means of multiplex access, and continuously transmits the transmiss

Abstract: A transmitting/receiving unit performs a plurality of data transmission operations and data reception operations in parallel via a plurality of data communication lines. A mode selecting unit is used for a user to select one of a line specifying mode and a free-line searching mode. A line determining unit determines a transmission line from among the plurality of data communication lines, the transmission line being then used for performing a data transmission operation by the transmitting/receiving unit. The line determining unit determines the transmission line as being a line selected by a user from among the plurality of data communication lines when the line specifying mode is selected through the mode selecting unit. The line determining unit searches the plurality of data communication lines for a free one so as to determine the transmission line as being the free one when the free-line searching mode is selected through the mode selecting unit.

Abstract: A speaker which is thin but which is capable of providing high-fidelity reproduction and ensuring a suitable level of sound pressure even when it is brought close to a wall. A closed chamber is formed behind one part of a disphragm mounted in an enclosure, and an open chamber is formed behind another part of the diaphragm. At least one voice coil driver unit is connected to the diaphragm. The phase difference between sounds radiated from the front and rear surfaces of the diaphragm is increased as large as possible by using an acoustic duct for the sound radiated through the open chamber, thereby minimizing cancellation of sounds and improving the sound pressure level.

Abstract: A transfer function is determined in accordance with an amplitude characteristic and a phase characteristic. The transfer function is subjected to inverse Fourier transform. An imaginary part of a result of the inverse Fourier transform is set to zero and thereby the result of the inverse Fourier transform is converted into a converted result. The converted result is subjected to Fourier transform. The amplitude characteristic and the phase characteristic are updated in accordance with a result of the Fourier transform. Such processes are reiterated. A primary desired amplitude characteristic is corrected in accordance with the finally-obtained amplitude characteristic so that the primary desired amplitude characteristic is converted into a final desired amplitude characteristic. A final desired phase characteristic is determined in accordance with the finally-obtained phase characteristic.