Patents by Inventor Seiichi Kamiyama

Seiichi Kamiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Source electrode and connector lead with notched portions for a semiconductor package
    Patent number: 11348862
    Abstract: Provided is a semiconductor device including: a semiconductor chip having a rectangular region including a first corner portion having a first notch portion, a second corner portion being provided to diagonally face the first corner portion, a third corner portion, and a fourth corner portion being provided to diagonally face the third corner portion on a surface and having a semiconductor element formed in the rectangular region; a first electrode including a fifth corner portion being provided on the first corner portion and having a second notch portion, a sixth corner portion being provided on the second corner portion, a seventh corner portion being provided on the third corner portion, and an eighth corner portion being provided on the fourth corner portion, the first electrode being provided on the semiconductor element, and the first electrode being electrically connected to the semiconductor element; and a first connector including a ninth corner portion being provided on the fifth corner portion and
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: May 31, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventor: Seiichi Kamiyama
  • SEMICONDUCTOR DEVICE
    Publication number: 20210296214
    Abstract: Provided is a semiconductor device including: a semiconductor chip having a rectangular region including a first corner portion having a first notch portion, a second corner portion being provided to diagonally face the first corner portion, a third corner portion, and a fourth corner portion being provided to diagonally face the third corner portion on a surface and having a semiconductor element formed in the rectangular region; a first electrode including a fifth corner portion being provided on the first corner portion and having a second notch portion, a sixth corner portion being provided on the second corner portion, a seventh corner portion being provided on the third corner portion, and an eighth corner portion being provided on the fourth corner portion, the first electrode being provided on the semiconductor element, and the first electrode being electrically connected to the semiconductor element; and a first connector including a ninth corner portion being provided on the fifth corner portion and
    Type: Application
    Filed: September 4, 2020
    Publication date: September 23, 2021
    Inventor: Seiichi KAMIYAMA
  • Semiconductor device including transistor
    Patent number: 9401398
    Abstract: According to one embodiment, a semiconductor device includes: a first region including: a first semiconductor layer; a first semiconductor region; a second semiconductor region; a third semiconductor region having higher impurity concentration than the first semiconductor region; a first electrode; a second electrode; an insulating film; a third electrode; a fourth electrode, a second region including a pad electrode, and the third region including: the first semiconductor layer; the first semiconductor region; a third semiconductor region; the first electrode; the second electrode; and a first insulating layer.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: July 26, 2016
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takeru Matsuoka, Yasuhito Saito, Seiichi Kamiyama
  • Fire retardant polycarbonate resin composition
    Patent number: 4155949
    Abstract: A fire retardant polycarbonate resin composition comprises diantimony tetroxide and a polycarbonate member selected from the class of halogenated polycarbonates and a mixture of (1) a halogen compound and (2) a polycarbonate.
    Type: Grant
    Filed: May 13, 1977
    Date of Patent: May 22, 1979
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Seiichi Kamiyama, Mitsuo Miura, Koji Takenaka
  • Process for producing a flame retardant isocyanurate resin
    Patent number: 4087414
    Abstract: A flame retardant isocyanurate resin is produced by polymerizing a polyfunctional isocyanate compound with a polyfunctional epoxy compound at a ratio of 0.05 - 0.2 equivalent of the polyfunctional epoxy compound per one equivalent of the polyfunctional isocyanate compound at a pressure of 1 - 800 kg/cm.sup.2 (gauge) at a temperature of 100.degree. - 250.degree. C in the presence of an organic isocyanate polymerization catalyst.
    Type: Grant
    Filed: September 10, 1976
    Date of Patent: May 2, 1978
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Seiichi Kamiyama, Norio Nagai, Hiroaki Miyamoto
  • Thermoplastic resin compositions
    Patent number: 3978158
    Abstract: A thermoplastic resin composition having excellent mechanical and thermal properties as well as excellent moldability comprising a bis(hydroxyaryl)alkanic polycarbonate and a rubber-modified polychlorostyrenic resin prepared by latex-blending a chlorostyrenic graft polymer latex and a chlorostyrenic copolymer latex.
    Type: Grant
    Filed: February 26, 1974
    Date of Patent: August 31, 1976
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Eiichi Yonemitsu, Seiichi Kamiyama, Toshiaki Kanada, Takeshi Hattori