Patents by Inventor Seiichi Kitazawa

Seiichi Kitazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition for solder resist ink
    Patent number: 4888269
    Abstract: A resin composition for use in a solder resist ink, said composition comprising as essential ingredients(A) an epoxy vinyl ester resin solution obtained by dissolving (A-a) an epoxy vinyl ester resin obtained by reacting a phenol novolak-type epoxy resin and/or a cresol novolak-type epoxy resin with 0.40 to 0.85 mol, per epoxy group of the epoxy resin, of an unsaturated monobasic acid in (A-b) an organic and/or (A-c) at least one photopolymerizable polyfunctional vinyl monomer selected from the group consisting trifunctional or higher polyoxyalkylene glycol poly(meth)acrylates, poly(meth)acrylates of polyoxyalkyl isocyanurates and poly(meth)acrylates of acetal compounds,(B) a photopolymerization initiator, and(C) a curing agent of an amino group and/or imino group-containing epoxy resin.
    Type: Grant
    Filed: August 11, 1988
    Date of Patent: December 19, 1989
    Assignees: Dainippon Ink & Chemicals, Inc., Asahi Chemical Research Laboratory, Ltd.
    Inventors: Yoneji Sato, Masato Hoshino, Seiichi Kitazawa, Tadashi Yasuda