Patents by Inventor Seiichi Komori

Seiichi Komori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wound-healing preparations
    Patent number: 4844898
    Abstract: A wound-healing preparation is composed of 50-90 wt. % of a sugar, 0.5-10 wt. % of povidone-iodine, and 1-20 wt. % of water. A buffer is also contained in an amount sufficient to adjust the pH of the preparation to 3.5-6. Preferably, the preparation may additionally contain 0.1-5 wt. % of an agent for imparting an appropriate consistency and stability, which is selected from polysaccharides and derivatives thereof.
    Type: Grant
    Filed: August 4, 1987
    Date of Patent: July 4, 1989
    Assignees: Kowa Co., Ltd., Teika Seiyaku Co., Ltd.
    Inventors: Seiichi Komori, Toyojiro Muramatsu