Patents by Inventor Seiichi Kouyama

Seiichi Kouyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Seat weight measuring apparatus
    Patent number: 7044006
    Abstract: A seat weight measuring apparatus includes a base frame and a sensor portion which is mounted on the base frame and configured to detect a load applied to a vehicle seat. The sensor portion includes a sensor plate provided with a plurality of measuring gauges, and the sensor plate is supported by and fixed to a column disposed on the base frame. The seat weight measuring apparatus has a heat transmission route through which heat transmitted to the column is directly transmitted from the column to the sensor plate. Further, the seat weight measuring apparatus includes, between the sensor plate and the column, a heat transmission bypass through which heat transmitted to the column is transmitted to the sensor plate to bypass the heat transmission route.
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: May 16, 2006
    Assignee: Takata Corporation
    Inventors: Seiichi Kouyama, Tomotoshi Senoh
  • Seat weight measuring apparatus
    Publication number: 20050044969
    Abstract: A seat weight measuring apparatus includes a base frame and a sensor portion which is mounted on the base frame and configured to detect a load applied to a vehicle seat. The sensor portion includes a sensor plate provided with a plurality of measuring gauges, and the sensor plate is supported by and fixed to a column disposed on the base frame. The seat weight measuring apparatus has a heat transmission route through which heat transmitted to the column is directly transmitted from the column to the sensor plate. Further, the seat weight measuring apparatus includes, between the sensor plate and the column, a heat transmission bypass through which heat transmitted to the column is transmitted to the sensor plate to bypass the heat transmission route.
    Type: Application
    Filed: May 25, 2004
    Publication date: March 3, 2005
    Inventors: Seiichi Kouyama, Tomotoshi Senoh