Abstract: A processing block 2 is composed of a base 5, where an upper substrate 6 formed with a metal material M and a lower substrate 7 formed with the metal material M or a ceramic material E are adhered, and cells C . . . supported by this base 5; and the cells C . . . are secured to the upper substrate 6 and/or the lower substrate 7 at least via cell positioners 6s . . . established in the upper substrate 6 for positioning the cells C . . . , respectively. At the same time, at least the thickness Ld of regions Xc . . . situated under the cells C . . . in the lower substrate 7 is selected to be 1.0 [mm] or thinner, and, a thermo-module(s) comes into contact with the lower surface of the base 5.

Abstract: A processing block 2 is composed of a base 5, where an upper substrate 6 formed with a metal material M and a lower substrate 7 formed with the metal material M or a ceramic material E are adhered, and cells C . . . supported by this base 5; and the cells C . . . are secured to the upper substrate 6 and/or the lower substrate 7 at least via cell positioners 6s . . . established in the upper substrate 6 for positioning the cells C . . . , respectively. At the same time, at least the thickness Ld of regions Xc . . . situated under the cells C . . . in the lower substrate 7 is selected to be 1.0 [mm] or thinner, and, a thermo-module(s) comes into contact with the lower surface of the base 5.