Patents by Inventor Seiichi Maki

Seiichi Maki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4391218
    Abstract: A method and apparatus for forming an electrically conductive layer on a corrosion-resistant layer which covers a cable. The cable is passed through a powder accumulating tank in which are mixed an electrically conductive powder and binder powder so as to allow the mixed powder to initially adhere to the surface of the cable. The mixed powder is then pressed against the surface of the cable first at a cable outlet of the powder accumulating tank and then with a powder applying device in which an endless powder applying belt or cloth is rotated around the cable at a rotational speed dependent upon the linear speed of the cable. The surface of the cable is then heated to melt the binder powder and cause the electrically conductive powder to yet more firmly adhere to the surface of the cable. The cable is then cooled and wound.
    Type: Grant
    Filed: October 19, 1981
    Date of Patent: July 5, 1983
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takahiro Horikawa, Yutaka Hibino, Seiichi Maki
  • Patent number: 4315883
    Abstract: A method and apparatus for forming an electrically conductive layer on a corrosion-resistant layer which covers a cable. The cable is passed through a powder accumulating tank in which are mixed an electrically conductive powder and binder powder so as to allow the mixed powder to initially adhere to the surface of the cable. The mixed powder is then pressed against the surface of the cable first at a cable outlet of the powder accumulating tank and then with a powder applying device in which an endless powder applying belt or cloth is rotated around the cable at a rotational speed dependent upon the linear speed of the cable. The surface of the cable is then heated to melt the binder powder and cause the electrically conductive powder to yet more firmly adhere to the surface of the cable. The cable is then cooled and wound.
    Type: Grant
    Filed: May 23, 1980
    Date of Patent: February 16, 1982
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takahiro Horikawa, Yutaka Hibino, Seiichi Maki