Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract: In an ultrasonic measuring method for measuring the thickness of a coating material applied by coating to one surface or both surfaces of a substrate made of a metal so as to provide a coated product, a pair of first ultrasonic sensor and second ultrasonic sensor are provided such that the first ultrasonic sensor is placed on one side of the coated product, as viewed in its thickness direction, via an air layer, while the second ultrasonic sensor is placed on the other side of the coated product, via an air layer, and the thickness of the coating material is measured by transmitting ultrasonic waves between the first and the second ultrasonic sensors. A flat-type transmitting sensor that permits propagation of unfocused ultrasonic waves is used as the first ultrasonic sensor, and a flat-type receiving sensor that permits propagation of unfocused ultrasonic waves is used as the second ultrasonic sensor.

Abstract: An ultrasonic measuring method and an ultrasonic measuring system use or include at least one actual-measurement ultrasonic sensor set each consisting of a first ultrasonic sensor and a second ultrasonic sensor, for measuring the basis weight of an electrode paste, and a calibration ultrasonic sensor set consisting of a pair of first calibration ultrasonic sensor and second calibration ultrasonic sensor. The calibration ultrasonic sensor set performs calibration during measurement of the thickness of the electrode paste, and the actual-measurement ultrasonic sensor set calculates the basis weight of the electrode paste, using a measurement condition value obtained by the calibration ultrasonic sensor set.

Abstract: The objective of the present invention is to provide an unexpected detecting apparatus enabled to evaluate an evenness of a compound coated on an electrode of a battery. The detecting apparatus (1) detects an evenness of a compound (12) coated on an electrode (10) of a battery, and includes a first sensor (20) for measuring a mass per unit area of the compound (12) in any points thereof, a second sensor (30, 50) for measuring a thickness of the compound (12) in the any points, and a holder (40, 60) for holding the first and second sensors (20, 30, 50), in which the first and second sensors (20, 30, 50) measure the mass and thickness at the same time, and the evenness is evaluated on the basis of the measured mass and thickness.

Abstract: A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract: In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature.

Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

Abstract: An ultrasonic measuring method and an ultrasonic measuring system use or include at least one actual-measurement ultrasonic sensor set each consisting of a first ultrasonic sensor and a second ultrasonic sensor, for measuring the basis weight of an electrode paste, and a calibration ultrasonic sensor set consisting of a pair of first calibration ultrasonic sensor and second calibration ultrasonic sensor. The calibration ultrasonic sensor set performs calibration during measurement of the thickness of the electrode paste, and the actual-measurement ultrasonic sensor set calculates the basis weight of the electrode paste, using a measurement condition value obtained by the calibration ultrasonic sensor set.

Abstract: In an ultrasonic measuring method for measuring the thickness of a coating material applied by coating to one surface or both surfaces of a substrate made of a metal so as to provide a coated product, a pair of first ultrasonic sensor and second ultrasonic sensor are provided such that the first ultrasonic sensor is placed on one side of the coated product, as viewed in its thickness direction, via an air layer, while the second ultrasonic sensor is placed on the other side of the coated product, via an air layer, and the thickness of the coating material is measured by transmitting ultrasonic waves between the first and the second ultrasonic sensors. A flat-type transmitting sensor that permits propagation of unfocused ultrasonic waves is used as the first ultrasonic sensor, and a flat-type receiving sensor that permits propagation of unfocused ultrasonic waves is used as the second ultrasonic sensor.

Abstract: The objective of the present invention is to provide an unexpected detecting apparatus enabled to evaluate an evenness of a compound coated on an electrode of a battery. The detecting apparatus (1) detects an evenness of a compound (12) coated on an electrode (10) of a battery, and includes a first sensor (20) for measuring a mass per unit area of the compound (12) in any points thereof, a second sensor (30, 50) for measuring a thickness of the compound (12) in the any points, and a holder (40, 60) for holding the first and second sensors (20, 30, 50), in which the first and second sensors (20, 30, 50) measure the mass and thickness at the same time, and the evenness is evaluated on the basis of the measured mass and thickness.

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract: In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature.

Abstract: This invention provides a hydrocarbon concentration measuring apparatus, which, even when the concentration and composition of hydrocarbons contained in an object gas to be measured vary, can measure the concentration of the hydrocarbons with good response and good accuracy, and a hydrocarbon measuring method. Light with a waveband including a common absorption region, which is absorbed by a single or a plurality of chemical species, is applied to the object gas by an infrared irradiation equipment. The light applied to the object gas is detected with a line sensor. The absorbance in the common absorption region of the object gas is computed with an analyzer based on the detected light. The sum of concentrations of chemical species, which absorb light in the waveband in the common absorption region, in the single or plurality of chemical species contained in the object gas, is computed with the analyzer based on the absorbance.

Abstract: A method for manufacturing a ceramic electronic component having excellent solderability is provided. In this method, the elution of barium from the ceramic electronic component and the adhesion of ceramic electronic components in tin plating are reduced. The method for manufacturing a ceramic electronic component includes the steps of providing an electronic component of barium-containing ceramic and forming an electrode on the outer surface of the electronic component, the electrode being electroplated with tin. In this method, a plating bath used in the tin plating has a tin ion concentration A in the range of 0.03 to 0.51 mol/L, a sulfate ion concentration B in the range of 0.005 to 0.31 mol/L, a molar ratio B/A of less than one, and a pH in the range of 6.1 to 10.5.

Abstract: A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.