Patents by Inventor Seiichi Mimura
Seiichi Mimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8256407Abstract: To provide a multi-wire saw that, at the start of cutting of an ingot, prevents a wire from being displaced in grooves of guide rollers due to the wire being lifted. A wire is wound around a plurality of wire guide rollers to be positioned in a feeding direction of an ingot, and in this state, a wire-lifting restraining member that is a body of rotation and restrains the wire from being lifted by being brought into contact with the wire is disposed near the wire guide rollers.Type: GrantFiled: June 27, 2007Date of Patent: September 4, 2012Assignee: Mitsubishi Electric CorporationInventors: Takafumi Kawasaki, Seiichi Mimura, Hirokazu Nishida
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Patent number: 8075647Abstract: The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to 55% by mass, based on a total mass of components of the slurry excluding the abrasive powder.Type: GrantFiled: October 20, 2006Date of Patent: December 13, 2011Assignee: Mitsubishi Electric CorporationInventors: Takafumi Kawasaki, Seiichi Mimura, Hirokazu Nishida, Yasuhiro Yoshida
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Publication number: 20100163009Abstract: To provide a multi-wire saw that, at the start of cutting of an ingot, prevents a wire from being displaced in grooves of guide rollers due to the wire being lifted. A wire is wound around a plurality of wire guide rollers to be positioned in a feeding direction of an ingot, and in this state, a wire-lifting restraining member that is a body of rotation and restrains the wire from being lifted by being brought into contact with the wire is disposed near the wire guide rollers.Type: ApplicationFiled: June 27, 2007Publication date: July 1, 2010Inventors: Takafumi Kawasaki, Seiichi Mimura, Hirokazu Nishida
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Publication number: 20100037880Abstract: The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to 55% by mass, based on a total mass of components of the slurry excluding the abrasive powder.Type: ApplicationFiled: October 10, 2006Publication date: February 18, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Takafumi Kawasaki, Seiichi Mimura, Hirokazu Nishida, Yasuhiro Yoshida
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Patent number: 7306508Abstract: A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.Type: GrantFiled: October 22, 2004Date of Patent: December 11, 2007Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Takafumi Kawasaki, Hirozoh Tsuruta, Hirokazu Nishida, Seiichi Mimura, Masayuki Hamayasu, Hisashi Tominaga
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Publication number: 20060249134Abstract: A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.Type: ApplicationFiled: October 22, 2004Publication date: November 9, 2006Inventors: Takafumi Kawasaki, Hirozoh Tsuruta, Hirokazu Nishida, Seiichi Mimura, Masayuki Hamayasu, Hisashi Tominaga
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Patent number: 6700231Abstract: A thrust converter includes reciprocation movement means 1; reciprocation-rotation conversion means 2 for converting reciprocating movement of the reciprocation movement means into rotational movement; rotation-reciprocation conversion means 7 for converting rotational movement of the reciprocation-rotation conversion means; and reaction-force receiving means 11 for supporting reaction force stemming from reciprocation movement of the rotation-reciprocation conversion means. Thrust imparted to the reciprocation movement means can be imparted to a load while being amplified or reduced, through employment of a compact and simple construction.Type: GrantFiled: December 31, 2001Date of Patent: March 2, 2004Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Kouichi Takamune, Seiichi Mimura, Hidenobu Ito, Yoshiyuki Hatsutori, Yoshio Kasuga, Takao Mizutani
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Publication number: 20020162409Abstract: To obtain a thrust converter constituted by a reciprocating means 1, a reciprocation-to-rotation converting means 5 for converting a reciprocating motion of the reciprocating means 1 into a rotary motion, a rotation-to-reciprocation converting means 11 located on the same axial line as that of the reciprocation-to-rotation converting means 5 for converting the rotary motion of the reciprocation-to-rotation converting means 5 into a reciprocating motion, a reaction force receiving means 15 for receiving reaction force against the reciprocating motion of the rotation-to-reciprocation converting means 11, and a moving means 92 for moving the reciprocation-to-rotation converting means 5 and the rotation-to-reciprocation converting means 11 in an axial direction separately from driving force due to the reciprocating motion of the reciprocating means 1. Accordingly, the length for the trust converting quantity can be shortened in proportion to the ratio of the stroke.Type: ApplicationFiled: February 12, 2002Publication date: November 7, 2002Inventors: Hidenobu Ito, Seiichi Mimura, Kouichi Takamune, Takao Mizutani
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Publication number: 20020158520Abstract: A thrust converter includes reciprocation movement means 1; reciprocation-rotation conversion means 2 for converting reciprocating movement of the reciprocation movement means into rotational movement; rotation-reciprocation conversion means 7 for converting rotational movement of the reciprocation-rotation conversion means; and reaction-force receiving means 11 for supporting reaction force stemming from reciprocation movement of the rotation-reciprocation conversion means. Thrust imparted to the reciprocation movement means can be imparted to a load while being amplified or reduced, through employment of a compact and simple construction.Type: ApplicationFiled: December 31, 2001Publication date: October 31, 2002Inventors: Kouichi Takamune, Seiichi Mimura, Hidenobu Ito, Yoshiyuki Hatsutori, Yoshio Kasuga, Takao Mizutani
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Patent number: 5882418Abstract: It is an object to improve the corrosion resistance of a CVD jig made of quartz to prevent exfoliation of a film attached on the surface to prevent dust. The surface of a quartz CVD jig is burned with an arc plasma torch 14 so that the OH concentration in the quartz surface remains under 30 ppm.Type: GrantFiled: August 4, 1997Date of Patent: March 16, 1999Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Atsuhiro Fujii, Kazuo Kobayashi, Yasuhiko Horie, Hiroshi Ohnishi, Seiichi Mimura
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Patent number: 5433822Abstract: A semiconductor device has circuit patterns formed on upper and lower surfaces of a laminated board with both surfaces lined with copper and interconnected by through holes, an IC chip mounted on the upper pattern, and external connection terminals mounted on the lower pattern, the external connection terminals comprising copper core bumps. According to a method of manufacturing such a semiconductor device, the same etching process as pattern etching for forming the circuit pattern are effected in bump forming regions on the circuit pattern formed by the resist pattern.Type: GrantFiled: December 22, 1992Date of Patent: July 18, 1995Assignee: Citizen Watch Co., Ltd.Inventors: Seiichi Mimura, Junichiro Shimizu, Takayuki Tajiri, Shingo Ichikawa, Hiroyuki Kaneko, Masayuki Ohi
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Patent number: 5289039Abstract: A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.Type: GrantFiled: July 7, 1992Date of Patent: February 22, 1994Assignee: Citizen Watch Co., Ltd.Inventors: Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Kikuo Takenouchi, Isao Yabe, Shingo Ichikawa, Yoshihiro Shimada
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Patent number: 5233225Abstract: A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.Type: GrantFiled: August 23, 1991Date of Patent: August 3, 1993Assignee: Citizen Watch Co., Ltd.Inventors: Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Kikuo Takenouchi, Isao Yabe, Shingo Ichikawa, Yoshihiro Shimada
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Patent number: 5179039Abstract: A method of making a resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.Type: GrantFiled: May 15, 1991Date of Patent: January 12, 1993Assignee: Citizen Watch Co., Ltd.Inventors: Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Kikuo Takenouchi, Isao Yabe, Shingo Ichikawa, Yoshihiro Shimada
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Patent number: 5108955Abstract: A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.Type: GrantFiled: February 6, 1991Date of Patent: April 28, 1992Assignee: Citizen Watch Co., Ltd.Inventors: Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Kikuo Takenouchi, Isao Yabe, Shingo Ichikawa, Yoshihiro Shimada