Patents by Inventor Seiichi Nishino

Seiichi Nishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5880926
    Abstract: An electrolytic capacitor device includes a capacitor which has a capacitor element and leads extending from one end of the element, and a square mounting board for use in mounting the capacitor device on a printed circuit board. The mounting board is connected to the one end of the capacitor. The leads are inserted into openings extending through the mounting board. The mounting board has parallel slits extending from the openings to one side edge of the mounting board. Each slit is wider in its open end at the one side edge of the mounting board than the diameter of the associated opening. The bottom surface of the mounting board has metal plate terminals which extend from the openings to different side edges of the mounting board. The terminals have rising portions extending upward along the inner walls of the slits and the openings. The leads have tip ends welded in their peripheries to the rising portions. The top surface of the mounting board has a U-shaped stop opening toward the one side edge.
    Type: Grant
    Filed: April 18, 1997
    Date of Patent: March 9, 1999
    Assignee: Nichicon Corporation
    Inventors: Seiichi Nishino, Kozaburo Okubo, Hiroyuki Nakagawa, Takashi Yokoyama, Takeru Nonoguchi
  • Patent number: 5063435
    Abstract: The present invention relates to a semiconductor casing which permits transmitting ultraviolet rays to a semiconductor chip within the casing. The semiconductor casing includes the substrate formed by a thin metal plate for mounting the semiconductor chip, a ceramic frame fixed to the periphery of the substrate, a ceramic cap which covers the semiconductor chip, is mounted on the ceramic frame and allows transmission of ultraviolet rays, and leads which are sandwiched between the ceramic frame and the ceramic cap to allow the electrical connection of the semiconductor chip.
    Type: Grant
    Filed: November 22, 1989
    Date of Patent: November 5, 1991
    Assignees: Sumitomo Electric Industries, Ltd., NEC Corporation
    Inventors: Satoru Okamoto, Kazufumi Terazi, Seiichi Nishino, Manabu Bonkohara
  • Patent number: 4843226
    Abstract: For protecting a semiconductor chips from an electric destruction due to electrostatic charges. A card-shaped information storage medium used for providing data information to an information processing unit comprising (a) a board member of an insulating material having an first occupation area for at least one semiconductor chip capable of preserving the data informations and a second occupation area for a plurality of communication terminals electrically coupled to the semiconductor chip, (b) a protective member covering the semiconductor chip and exposing the communication terminals to the outside thereof, and (c) a protective shutter movable into or out of the protective member for shifting a position of the information storage medium between a closed state and an open state. The communication terminals are covered with the protective shutter in the closed state, thereby preventing the communication terminals from a human body with the electrostatic charges.
    Type: Grant
    Filed: January 14, 1988
    Date of Patent: June 27, 1989
    Assignee: NEC Corporation
    Inventors: Kaneyuki Kato, Kazufumi Teraji, Seiichi Nishino, Teruo Suzuki