Patents by Inventor Seiichi OHMORI

Seiichi OHMORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230273017
    Abstract: Provided is a thickness measurement device, including: an ultrasonic transmitter configured to transmit ultrasonic waves to a measurement object; an ultrasonic receiver configured to receive the ultrasonic waves reflected by the measurement object; a first extraction unit configured to extract a first reflected wave reflected by a first surface in the measurement object; a second extraction unit configured to extract a plurality of candidates for a second reflected wave reflected by a second surface in the measurement object; a matching degree calculation unit configured to calculate a matching degree between the first reflected wave and each of the plurality of candidates, for the each of the plurality of candidates; a candidate determination unit configured to determine, from the plurality of candidates, a candidate having the largest matching degree as the second reflected wave; and a thickness calculation unit configured to calculate a thickness of the measurement object.
    Type: Application
    Filed: May 8, 2023
    Publication date: August 31, 2023
    Applicant: IHI Corporation
    Inventors: Seiichi OHMORI, Masahiro HATO, Tomohiko SHIOTA
  • Patent number: 11680879
    Abstract: A tensile load is applied to the test body to increase with time, and an AE wave displacement in the test body is detected (step S1). From the detected AE wave, waveform data are generated for each time section (step S2). For each section, from the waveform data, spectrum data are generated (step S3), a peak of an intensity in the spectrum data is specified, a data part in which an intensity is at least a value of a set percentage of the peak in the spectrum data is extracted as processing target data (step S4), and from the processing target data, the most frequent value of frequency gravity centers is specified (step S5). The most frequent value for each section and a tensile load applied to the test body in each section are output as strength evaluation data for evaluating a tensile strength of the test body (step S6).
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: June 20, 2023
    Assignee: IHI Inspection and Instrumentation Co., Ltd.
    Inventors: Seiichi Ohmori, Mami Ohmori, Hideyuki Nakamura, Hiraku Kawasaki
  • Publication number: 20210018410
    Abstract: A tensile load is applied to the test body to increase with time, and an AE wave displacement in the test body is detected (step S1). From the detected AE wave, waveform data are generated for each time section (step S2). For each section, from the waveform data, spectrum data are generated (step S3), a peak of an intensity in the spectrum data is specified, a data part in which an intensity is at least a value of a set percentage of the peak in the spectrum data is extracted as processing target data (step S4), and from the processing target data, the most frequent value of frequency gravity centers is specified (step S5). The most frequent value for each section and a tensile load applied to the test body in each section are output as strength evaluation data for evaluating a tensile strength of the test body (step S6).
    Type: Application
    Filed: February 21, 2019
    Publication date: January 21, 2021
    Applicant: IHI Inspection and Instrumentation Co., Ltd.
    Inventors: Seiichi OHMORI, Mami OHMORI, Hideyuki NAKAMURA, Hiraku KAWASAKI