Abstract: There are provided a metal-resin joint having high bonding strength and a manufacturing method thereof. A metal-resin joint 10 of the present disclosure includes an anchor portion 34 provided on a metal bonding surface 32 of a metal member 30. The anchor portion 34 has a pair of protrusion strips 35 and 35 protruding from the metal bonding surface 32 with a gap, a recessed groove 36 provided between the pair of protrusion strips 35 and 35, and a plurality of partitions 37 protruding from a groove bottom of the recessed groove 36. The plurality of partitions 37 are provided to be inclined toward one side Y1 in a direction in which the pair of protrusion strips 35 and 35 extend as going toward a distal end side, and to be side by side in a direction Y in which the pair of protrusion strips 35 and 35 extend.

Abstract: There are provided a metal-resin joint having high bonding strength and a manufacturing method thereof. A metal-resin joint 10 of the present disclosure includes an anchor portion 34 provided on a metal bonding surface 32 of a metal member 30. The anchor portion 34 has a pair of protrusion strips 35 and 35 protruding from the metal bonding surface 32 with a gap, a recessed groove 36 provided between the pair of protrusion strips 35 and 35, and a plurality of partitions 37 protruding from a groove bottom of the recessed groove 36. The plurality of partitions 37 are provided to be inclined toward one side Y1 in a direction in which the pair of protrusion strips 35 and 35 extend as going toward a distal end side, and to be side by side in a direction Y in which the pair of protrusion strips 35 and 35 extend.

Abstract: A method for manufacturing a metal-resin joint 30 according to the present disclosure is a method for manufacturing the metal-resin joint 30 in which a synthetic resin member 10 made of thermoplastic resin and a metal member 20 made of metal are bonded to each other, the method including: a first process of exposing a surface 12 of the synthetic resin member 10 molded into a predetermined shape, to air heated to a first temperature T1 equal to or higher than a deflection temperature under load Tf of the thermoplastic resin when a load of 1.8 MPa is applied; and a second process of bonding the surface 12 of the synthetic resin member 10 and a surface 22 of the metal member 20 to each other. Accordingly, it is possible to improve the bonding strength between the metal member 20 and the synthetic resin member 10.

Abstract: A method for manufacturing a metal-resin joint 30 according to the present disclosure is a method for manufacturing the metal-resin joint 30 in which a synthetic resin member 10 made of thermoplastic resin and a metal member 20 made of metal are bonded to each other, the method including: a first process of exposing a surface 12 of the synthetic resin member 10 molded into a predetermined shape, to air heated to a first temperature T1 equal to or higher than a deflection temperature under load Tf of the thermoplastic resin when a load of 1.8 MPa is applied; and a second process of bonding the surface 12 of the synthetic resin member 10 and a surface 22 of the metal member 20 to each other. Accordingly, it is possible to improve the bonding strength between the metal member 20 and the synthetic resin member 10.

Abstract: A surface of a metal substrate formed from a metal is heated, an oxide film is formed on the surface of the metal substrate, at least a portion of the oxide film is heated so as to increase a joining strength of the oxide film to the metal substrate, subsequently a synthetic resin substrate formed from a synthetic resin is joined to the oxide film, and thus a metal-resin joined body is obtained. Thereby, a metal-resin joined body having high joining strength is obtained.

Abstract: There is provided a wafer for examination that is a wafer for examination with which energy distribution in a region of a light condensing spot of a laser beam with which irradiation is carried out from the upper surface side of a wafer is checked, and is a wafer for examination in which a first metal layer and a second metal layer different in specific heat or a melting point are formed over an upper surface of a wafer. In an examination method of energy distribution, the energy distribution of the laser beam is checked based on a processing mark formed in the first and second metal layers of the wafer for examination.

Abstract: A surface of a metal substrate formed from a metal is heated, an oxide film is formed on the surface of the metal substrate, at least a portion of the oxide film is heated so as to increase a joining strength of the oxide film to the metal substrate, subsequently a synthetic resin substrate formed from a synthetic resin is joined to the oxide film, and thus a metal-resin joined body is obtained. Thereby, a metal-resin joined body having high joining strength is obtained.

Abstract: There is provided a wafer for examination that is a wafer for examination with which energy distribution in a region of a light condensing spot of a laser beam with which irradiation is carried out from the upper surface side of a wafer is checked, and is a wafer for examination in which a first metal layer and a second metal layer different in specific heat or a melting point are formed over an upper surface of a wafer. In an examination method of energy distribution, the energy distribution of the laser beam is checked based on a processing mark formed in the first and second metal layers of the wafer for examination.

Abstract: There is provided a condensing point position detecting method of detecting a position in an optical axis direction of a condensing point of a laser beam condensed by a condenser of a laser processing apparatus. The condensing point position detecting method includes: an irradiation mark forming step of forming a plurality of irradiation marks in a substrate by irradiating the substrate held by a chuck table with the laser beam while moving the condenser in the optical axis direction with respect to the substrate; and a condensing point position detecting step of detecting an irradiation mark having a proper shape from the plurality of irradiation marks formed in the substrate, and detecting the position of the condensing point forming the proper irradiation mark as a position of an accurate condensing point.

Abstract: There is provided a condensing point position detecting method of detecting a position in an optical axis direction of a condensing point of a laser beam condensed by a condenser of a laser processing apparatus. The condensing point position detecting method includes: an irradiation mark forming step of forming a plurality of irradiation marks in a substrate by irradiating the substrate held by a chuck table with the laser beam while moving the condenser in the optical axis direction with respect to the substrate; and a condensing point position detecting step of detecting an irradiation mark having a proper shape from the plurality of irradiation marks formed in the substrate, and detecting the position of the condensing point forming the proper irradiation mark as a position of an accurate condensing point.