Abstract: A method of making a tape-carrier for manufacturing IC elements comprising: (A) a resist coating process for coating a resist onto both surfaces of a metallic foil; (B) a resist patterning process for removing the resist from the portions on one surface of the metallic foil where the terminals of an IC chip are to be positioned, and for removing the resist from an outer region of an area on the other surface of the metallic foil where lead terminals are to be formed; (C) a plating process for plating the portions, where the resist are removed from the one surface of the metallic foil, with a metal so as to form metallic bumps on the metallic foil; and (D) an etching process for etching the outer region of the area where the lead terminals are to be formed, so that each of the lead terminals has a bump formed on the end portion thereof.