Patents by Inventor Seiichi Takayama

Seiichi Takayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12027179
    Abstract: A thermally assisted magnetic head includes a slider having a slider substrate and a magnetic head part, and a light source unit having a laser diode and a sub-mount. The magnetic head part includes a medium-opposite surface, a light source-opposite surface, and a slider-front end surface. The sub-mount includes a joined-end surface and a mount-front end surface, the laser diode includes an electrode surface and an LD-front end surface. The light source unit includes a shift joined structure which the laser diode is joined to a shift area of the joined-end surface, and the light source unit is mounted on the slider substrate so that the electrode surface intersects with a laminated surface of the magnetic head part. The shift area is set in a position which is shifted so that the LD-front end surface is away from the slider-front end surface than the mount-front end surface.
    Type: Grant
    Filed: May 26, 2023
    Date of Patent: July 2, 2024
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Seiichi Takayama, Ryuji Fujii, Yasutoshi Fujita, Ka Yip Wong, Chi Hung Yuen
  • Patent number: 11899390
    Abstract: A recording-material-transporting apparatus includes: a transport unit that transports a recording material along a transport path; an image reading unit that is disposed on one side of the transport path and that reads an image formed on the recording material transported along the transport path; and a rotating member disposed opposite the image reading unit with the transport path provided therebetween. At least one portion of the rotating member contacts the image reading unit, or a rotating member support that supports the rotating member contacts the image reading unit.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: February 13, 2024
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Seiichi Takayama, Masakazu Shirai, Taketoshi Tanaka, Tadashi Sugizaki
  • Patent number: 11887638
    Abstract: The laser diode includes an electrode pad layer, being connected to an electrode, and an outer surface in which the electrode pad layer is formed. The electrode pad layer includes a solder-bonding pad part and a solder-contact preventing part. The solder-contact preventing part is formed with small wettability material having solder wettability which is smaller than solder wettability of the solder-bonding pad part. The solder-bonding pad part and the solder-contact preventing part are formed so that a pad height, being a height from the outer surface to a surface of the solder-bonding pad part, is larger than a preventing height, being a height from the outer surface to a surface of the solder-contact preventing part.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: January 30, 2024
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Ryo Hosoi, Seiichi Takayama, Kang Gao, Yasuhiro Konakawa, Yasutoshi Fujita, Ryuji Fujii
  • Patent number: 11817678
    Abstract: A semiconductor laser includes an active layer which emits laser light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions. The laser radar device includes a light projection part which projects laser light and a light receiving part which receives reflected light of the laser light. The light projection part includes the semiconductor laser and a scanner which reflects the laser light, emitted from the semiconductor laser, to form a scanning laser light.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: November 14, 2023
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Seiichi Takayama, Kang Gao, Ryo Hosoi, Ryuji Fujii
  • Publication number: 20230305473
    Abstract: A recording-material-transporting apparatus includes: a transport unit that transports a recording material along a transport path; an image reading unit that is disposed on one side of the transport path and that reads an image formed on the recording material transported along the transport path; and a rotating member disposed opposite the image reading unit with the transport path provided therebetween. At least one portion of the rotating member contacts the image reading unit, or a rotating member support that supports the rotating member contacts the image reading unit.
    Type: Application
    Filed: September 9, 2022
    Publication date: September 28, 2023
    Applicant: FUJIFILM BUSINESS INNOVATION CORP.
    Inventors: Seiichi TAKAYAMA, Masakazu SHIRAI, Taketoshi TANAKA, Tadashi SUGIZAKI
  • Patent number: 11763842
    Abstract: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap between an electrode surface of the laser diode and the flexure, and being in unmelted-solid condition.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: September 19, 2023
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Ka Yip Wong, Chi Hung Yuen, Ryo Hosoi, Seiichi Takayama
  • Patent number: 11749302
    Abstract: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: September 5, 2023
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Ka Yip Wong, Chi Hung Yuen, Ryo Hosoi, Seiichi Takayama
  • Patent number: 11626133
    Abstract: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which a solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size smaller than a wiring gap between an electrode surface of the laser diode and the flexure, and being in melted-particle condition.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: April 11, 2023
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Ka Yip Wong, Chi Hung Yuen, Ryo Hosoi, Seiichi Takayama
  • Publication number: 20220311217
    Abstract: A semiconductor laser includes an active layer which emits laser light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions. The laser radar device includes a light projection part which projects laser light and a light receiving part which receives reflected light of the laser light. The light projection part includes the semiconductor laser and a scanner which reflects the laser light, emitted from the semiconductor laser, to form a scanning laser light.
    Type: Application
    Filed: March 25, 2021
    Publication date: September 29, 2022
    Inventors: Seiichi Takayama, Kang Gao, Ryo Hosoi, Ryuji Fujii
  • Patent number: 11333326
    Abstract: A light emitting device includes a light emitting unit including plural light emitting elements arranged in one direction, the light emitting unit being positioned at a predetermined position at both ends in the one direction, the light emitting elements emitting light in a same direction; a dynamic vibration absorber including a weight positioned at a center of the light emitting unit in the one direction and an elastic portion that supports the weight such that the weight is capable of vibrating, the dynamic vibration absorber being attached to the light emitting unit to absorb vibration of the light emitting unit; and an attaching member including a portion inserted in a groove formed in the elastic portion of the dynamic vibration absorber, the portion being used to attach the dynamic vibration absorber to the light emitting unit.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: May 17, 2022
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Yuji Kando, Yosuke Kasuya, Shuichi Nishide, Seiichi Takayama
  • Publication number: 20220128223
    Abstract: A light emitting device includes a light emitting unit including plural light emitting elements arranged in one direction, the light emitting unit being positioned at a predetermined position at both ends in the one direction, the light emitting elements emitting light in a same direction; a dynamic vibration absorber including a weight positioned at a center of the light emitting unit in the one direction and an elastic portion that supports the weight such that the weight is capable of vibrating, the dynamic vibration absorber being attached to the light emitting unit to absorb vibration of the light emitting unit; and an attaching member including a portion inserted in a groove formed in the elastic portion of the dynamic vibration absorber, the portion being used to attach the dynamic vibration absorber to the light emitting unit.
    Type: Application
    Filed: May 20, 2021
    Publication date: April 28, 2022
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Yuji KANDO, Yosuke KASUYA, Shuichi NISHIDE, Seiichi TAKAYAMA
  • Patent number: 11127424
    Abstract: A light source-unit includes a laser diode, a sub-mount which the laser diode is joined. The laser diode includes an optical generating layer including an active layer which emits laser-light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: September 21, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Kang Gao, Seiichi Takayama, Ryo Hosoi, Ryuji Fujii
  • Patent number: 10943613
    Abstract: A thermally assisted magnetic head including a slider and a light source-unit. The slider includes a slider substrate and a magnetic head part. The light source-unit includes a laser diode and a sub-mount. The magnetic head part includes a medium-opposing surface, a light source-opposing surface and a waveguide which guides laser light from the light source-opposing surface to the medium-opposing surface. The slider substrate includes a light source-cavity formed in a light source-placing surface on which the light source-unit is placed. The light source-cavity includes an opening concave part being formed larger than a mount bottom surface of the sub-mount. The mount bottom surface of the sub-mount is inserted into the opening concave part to be joined to the light source-cavity.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: March 9, 2021
    Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.
    Inventors: Ryo Hosoi, Takashi Honda, Seiichi Takayama, Sik Fun Chan, Tai Boon Lee, Dayu Zhou
  • Patent number: 10650856
    Abstract: A thermally assisted magnetic head including a slider and a light source-unit. The slider includes a slider substrate and a magnetic head part. The light source-unit includes a laser diode and a sub-mount. The magnetic head part includes a medium-opposing surface, a light source-opposing surface and a waveguide which guides laser light from the light source-opposing surface to the medium-opposing surface. The thermally assisted magnetic head includes an optimal-structure which the following optimizing conditional expression, concerning an inlet-optical path length L1 of an inlet-interval of the waveguide, and an outlet-optical path length L2 of an outlet-interval, is satisfied, m1×L1=L2 (m1 is a natural number).
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: May 12, 2020
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Ryo Hosoi, Seiichi Takayama
  • Patent number: 10614841
    Abstract: A thermally assisted magnetic head includes a slider, the slider includes a slider substrate and a magnetic head part. The magnetic head part includes a medium-opposing surface opposing a magnetic recording medium, a light source-opposing surface arranged rear side of the medium-opposing surface, an anti-reflection film formed on the light source-opposing surface, a core layer and a cladding layer. The anti-reflection film includes a stacked structure which a first layer and a second layer are stacked. The second layer is formed with high refractive index dielectric having the refractive index higher than the first layer.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: April 7, 2020
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Ryo Hosoi, Seiichi Takayama, Natsuo Nishijima, Takashi Honda
  • Patent number: 10510371
    Abstract: A light source-unit comprises a laser diode, a sub-mount which the laser diode is joined, and a heater which is joined on a joint surface of the sub-mount. The sub-mount comprises a pair of barrier-members. The barrier-members are formed with lower thermal conductivity material which thermal conductivity is lower than joining metal which is used for joining the laser diode and the sub-mount. The barrier-members are formed on the joint surface so as to sandwich the heater.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: December 17, 2019
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Ryo Hosoi, Takashi Honda, Seiichi Takayama
  • Patent number: 10496003
    Abstract: An exposure device includes an exposure section, a weight, and an elastic portion. The exposure section includes plural light emitting elements arranged along an axial direction of an image holding member that is rotatable, is positioned with respect to the image holding member at both ends in the axial direction, and exposes the image holding member to light by emitting light to the image holding member. The weight is disposed so as to face the exposure section, and has a mass determined in advance. The elastic portion is elastic, and is disposed between the exposure section and the weight to support the weight so as to be vibratable.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: December 3, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Hiroshi No, Shuichi Nishide, Seiichi Takayama
  • Patent number: 10311903
    Abstract: A method of testing dynamic performances for a slider body of a thermally-assisted magnetic head includes: providing a slider body which is disconnected with a light source unit; removably mounting the slider body to a test head suspension assembly; keeping to provide a flat top beam to the slider body, the flat top beam being aligned with the optical waveguide, and a projection of an incident end of the optical waveguide being located within a light spot of the flat top beam; and testing the dynamic performance of the slider body. It can save the material cost and labor cost, and eliminate a precise optical alignment between an input light and an optical waveguide in the slider body to improve testing efficiency.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: June 4, 2019
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Seiichi Takayama, Takashi Honda, Ryuji Fujii, Ryo Hosoi, Kaichiu Cheung, Tsutomu Sasaki, Jingtao Lu, Fanglong Nie
  • Publication number: 20190072873
    Abstract: An exposure device includes an exposure section, a weight, and an elastic portion. The exposure section includes plural light emitting elements arranged along an axial direction of an image holding member that is rotatable, is positioned with respect to the image holding member at both ends in the axial direction, and exposes the image holding member to light by emitting light to the image holding member. The weight is disposed so as to face the exposure section, and has a mass determined in advance. The elastic portion is elastic, and is disposed between the exposure section and the weight to support the weight so as to be vibratable.
    Type: Application
    Filed: August 7, 2018
    Publication date: March 7, 2019
    Applicant: FUJI XEROX CO.,LTD.
    Inventors: Hiroshi NO, Shuichi NISHIDE, Seiichi TAKAYAMA
  • Publication number: 20190005980
    Abstract: A method of testing dynamic performances for a slider body of a thermally-assisted magnetic head includes: providing a slider body which is disconnected with a light source unit; removably mounting the slider body to a test head suspension assembly; keeping to provide a flat top beam to the slider body, the flat top beam being aligned with the optical waveguide, and a projection of an incident end of the optical waveguide being located within a light spot of the flat top beam; and testing the dynamic performance of the slider body. It can save the material cost and labor cost, and eliminate a precise optical alignment between an input light and an optical waveguide in the slider body to improve testing efficiency.
    Type: Application
    Filed: July 14, 2017
    Publication date: January 3, 2019
    Inventors: Seiichi TAKAYAMA, Takashi HONDA, Ryuji FUJII, Ryo HOSOI, Kaichiu CHEUNG, Tsutomu SASAKI, Jingtao LU, Fanglong NIE