Patents by Inventor Seiichi Tsuji

Seiichi Tsuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11227850
    Abstract: A method includes: providing a package body including a mounting part having a chip mounting region for mounting a semiconductor chip, a side wall part having a first sealing surface continuously provided over an entire perimeter of the mounting part, surrounding the chip mounting region and provided on the mounting part, a first recess provided on the first sealing surface, and a first solder outflow prevention part continuously provided on the first sealing surface and positioned closer to the chip mounting region side than the first recess; providing a cap having a second sealing surface facing the first sealing surface; providing a ball solder made of an alloy of gold and tin as principal ingredients; placing the ball solder in the first recess; placing the cap on the ball solder; and melting once and then solidifying the ball solder to bond the first sealing surface and the second sealing surface.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: January 18, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventor: Seiichi Tsuji
  • Publication number: 20210296272
    Abstract: A method includes: providing a package body including a mounting part having a chip mounting region for mounting a semiconductor chip, a side wall part having a first sealing surface continuously provided over an entire perimeter of the mounting part, surrounding the chip mounting region and provided on the mounting part, a first recess provided on the first sealing surface, and a first solder outflow prevention part continuously provided on the first sealing surface and positioned closer to the chip mounting region side than the first recess; providing a cap having a second sealing surface facing the first sealing surface; providing a ball solder made of an alloy of gold and tin as principal ingredients; placing the ball solder in the first recess; placing the cap on the ball solder; and melting once and then solidifying the ball solder to bond the first sealing surface and the second sealing surface.
    Type: Application
    Filed: July 22, 2020
    Publication date: September 23, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventor: Seiichi TSUJI
  • Patent number: 8796697
    Abstract: A semiconductor device includes: a package; an input matching circuit and an output matching circuit in the package; and transistor chips between the input matching circuit and the output matching circuit in the package. Each transistor chip includes a semiconductor substrate having long sides and short sides that are shorter than the long sides, and a gate electrode, a drain electrode and a source electrode on the semiconductor substrate. The gate electrode has gate fingers arranged along the long sides of the semiconductor substrate and a gate pad commonly connected to the gate fingers and connected to the input matching circuit via a first wire. The drain electrode is connected to the output matching circuit via a second wire. The long sides of the semiconductor substrates of the transistor chips are oblique with respect to an input/output direction extending from the input matching circuit to the output matching circuit.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: August 5, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tetsuo Kunii, Seiichi Tsuji, Motoyoshi Koyanagi
  • Publication number: 20140014969
    Abstract: A semiconductor device includes: a package; an input matching circuit and an output matching circuit in the package; and transistor chips between the input matching circuit and the output matching circuit in the package. Each transistor chip includes a semiconductor substrate having long sides and short sides that are shorter than the long sides, and a gate electrode, a drain electrode and a source electrode on the semiconductor substrate. The gate electrode has gate fingers arranged along the long sides of the semiconductor substrate and a gate pad commonly connected to the gate fingers and connected to the input matching circuit via a first wire. The drain electrode is connected to the output matching circuit via a second wire. The long sides of the semiconductor substrates of the transistor chips are oblique with respect to an input/output direction extending from the input matching circuit to the output matching circuit.
    Type: Application
    Filed: March 14, 2013
    Publication date: January 16, 2014
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tetsuo Kunii, Seiichi Tsuji, Motoyoshi Koyanagi
  • Patent number: 6796604
    Abstract: To provide a front-end panel which is low-cost and looks attractive when incorporating a reinforcement, a front-end panel includes a first holding member provided along the reinforcement so as to hold one edge of the reinforcement, a second holding member provided along the reinforcement so as to hold the other edge of the reinforcement, and connecting bands for connecting the first holding member with the second holding member.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: September 28, 2004
    Assignees: GP Daikyo Corporation, Mazda Motor Corporation
    Inventors: Tsuyoshi Igura, Kazuki Hatakeyama, Masanao Ogura, Seiichi Tsuji
  • Publication number: 20040046422
    Abstract: To provide a front-end panel which is low-cost and looks attractive when incorporating a reinforcement, a front-end panel includes a first holding member provided along the reinforcement so as to hold one edge of the reinforcement, a second holding member provided along the reinforcement so as to hold the other edge of the reinforcement, and connecting bands for connecting the first holding member with the second holding member.
    Type: Application
    Filed: July 9, 2003
    Publication date: March 11, 2004
    Inventors: Tsuyoshi Igura, Kazuki Hatakeyama, Masanao Ogura, Seiichi Tsuji
  • Patent number: 5477938
    Abstract: A power plant support structure for supporting a power plant of a vehicle includes a center frame extending in a lengthwise direction of the car body. The center frame is connected, at its lengthwise ends, to front and rear cross members, disposed forward and rearward of the power plant and extending between front side frames. A front mount is secured to the center frame before the power plant and connects the power plant to the center frame. The center frame absorbs an impact exerted on the power plant during a front-end collision of the vehicle.
    Type: Grant
    Filed: October 5, 1994
    Date of Patent: December 26, 1995
    Assignee: Mazda Motor Corporation
    Inventors: Seiichi Tsuji, Yoshikazu Ide, Mitsuru Fujinaka, Masayoshi Sannomiya
  • Patent number: 5372216
    Abstract: A power plant support structure for supporting a power plant of a vehicle includes a center frame extending in a lengthwise direction of the car body. The center frame is connected, at its lengthwise ends, to front and rear cross members, disposed forward and rearward of the power plant and extending between front side frames. A front mount is secured to the center frame before the power plant and connects the power plant to the center frame. The center frame absorbs an impact exerted on the power plant during a front-end collision of the vehicle.
    Type: Grant
    Filed: April 1, 1994
    Date of Patent: December 13, 1994
    Assignee: Mazda Motor Corporation
    Inventors: Seiichi Tsuji, Yoshikazu Ide, Mitsuru Fujinaka, Masayoshi Sannomiya
  • Patent number: 5195607
    Abstract: A dual type exhaust system is used in an automobile having an internal combustion engine with transversely mounted front and rear rows of cylinders. Two exhaust pipe assemblies extend from the front and rear rows of cylinders, respectively, toward the back of the car body. The two assemblies are arranged side by side in a space formed in a floor panel. The exhaust pipe assemblies are, respectively, provided with catalytic converters offset in a lengthwise direction of the car body with respect to the space relative to each other so as to be arranged in a straight line in the space.
    Type: Grant
    Filed: November 19, 1990
    Date of Patent: March 23, 1993
    Assignee: Mazda Motor Corporation
    Inventors: Yukiichiro Shimada, Nobuhiro Komatsu, Seiichi Tsuji, Satoshi Fujita, Hiroshi Nakatsuka, Hiromichi Kawamura, Makoto Shinhama
  • Patent number: 4690432
    Abstract: A support of an automobile gauge cluster on a steering column for permitting a steering wheel to tilt up and down. The gauge cluster is provided for tilting motion in response to the tilting of the steering wheel and there is employed a bracket structure for the support of the steering column having a steering shaft rotatably extending therein. The bracket structure is rigidly connected with a portion of an automobile body structure and has a guide provided therein for guiding the tilting motion of the gauge cluster.
    Type: Grant
    Filed: October 23, 1985
    Date of Patent: September 1, 1987
    Assignee: Mazda Motor Corporation
    Inventors: Toshinori Sakamoto, Isao Hirashima, Seiichi Tsuji
  • Patent number: 4664595
    Abstract: A novel combination of sliding members operable both under dry (without lubrication) and wet (with lubrication) states, which comprises a first member made of a ceramic and a second member made of hard metal containing at least 75% by weight cemented carbide. This combination is useful as a bearing means in a pump of a vertical or inclined shaft type so as to permit actuation of the motor in the dry state and thereafter to continue operation of the pump with lubrication being provided by part of the liquid being pumped. In certain aspects, the ceramic member may be divided into a plurality of segments.
    Type: Grant
    Filed: September 14, 1984
    Date of Patent: May 12, 1987
    Assignee: Ebara Corporation
    Inventors: Seiichi Tsuji, Kazuhiro Ogawara, Shikuo Koide, Shotaro Mizobuchi