Patents by Inventor Seiichi Tsuji
Seiichi Tsuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11227850Abstract: A method includes: providing a package body including a mounting part having a chip mounting region for mounting a semiconductor chip, a side wall part having a first sealing surface continuously provided over an entire perimeter of the mounting part, surrounding the chip mounting region and provided on the mounting part, a first recess provided on the first sealing surface, and a first solder outflow prevention part continuously provided on the first sealing surface and positioned closer to the chip mounting region side than the first recess; providing a cap having a second sealing surface facing the first sealing surface; providing a ball solder made of an alloy of gold and tin as principal ingredients; placing the ball solder in the first recess; placing the cap on the ball solder; and melting once and then solidifying the ball solder to bond the first sealing surface and the second sealing surface.Type: GrantFiled: July 22, 2020Date of Patent: January 18, 2022Assignee: Mitsubishi Electric CorporationInventor: Seiichi Tsuji
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Publication number: 20210296272Abstract: A method includes: providing a package body including a mounting part having a chip mounting region for mounting a semiconductor chip, a side wall part having a first sealing surface continuously provided over an entire perimeter of the mounting part, surrounding the chip mounting region and provided on the mounting part, a first recess provided on the first sealing surface, and a first solder outflow prevention part continuously provided on the first sealing surface and positioned closer to the chip mounting region side than the first recess; providing a cap having a second sealing surface facing the first sealing surface; providing a ball solder made of an alloy of gold and tin as principal ingredients; placing the ball solder in the first recess; placing the cap on the ball solder; and melting once and then solidifying the ball solder to bond the first sealing surface and the second sealing surface.Type: ApplicationFiled: July 22, 2020Publication date: September 23, 2021Applicant: Mitsubishi Electric CorporationInventor: Seiichi TSUJI
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Patent number: 8796697Abstract: A semiconductor device includes: a package; an input matching circuit and an output matching circuit in the package; and transistor chips between the input matching circuit and the output matching circuit in the package. Each transistor chip includes a semiconductor substrate having long sides and short sides that are shorter than the long sides, and a gate electrode, a drain electrode and a source electrode on the semiconductor substrate. The gate electrode has gate fingers arranged along the long sides of the semiconductor substrate and a gate pad commonly connected to the gate fingers and connected to the input matching circuit via a first wire. The drain electrode is connected to the output matching circuit via a second wire. The long sides of the semiconductor substrates of the transistor chips are oblique with respect to an input/output direction extending from the input matching circuit to the output matching circuit.Type: GrantFiled: March 14, 2013Date of Patent: August 5, 2014Assignee: Mitsubishi Electric CorporationInventors: Tetsuo Kunii, Seiichi Tsuji, Motoyoshi Koyanagi
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Publication number: 20140014969Abstract: A semiconductor device includes: a package; an input matching circuit and an output matching circuit in the package; and transistor chips between the input matching circuit and the output matching circuit in the package. Each transistor chip includes a semiconductor substrate having long sides and short sides that are shorter than the long sides, and a gate electrode, a drain electrode and a source electrode on the semiconductor substrate. The gate electrode has gate fingers arranged along the long sides of the semiconductor substrate and a gate pad commonly connected to the gate fingers and connected to the input matching circuit via a first wire. The drain electrode is connected to the output matching circuit via a second wire. The long sides of the semiconductor substrates of the transistor chips are oblique with respect to an input/output direction extending from the input matching circuit to the output matching circuit.Type: ApplicationFiled: March 14, 2013Publication date: January 16, 2014Applicant: Mitsubishi Electric CorporationInventors: Tetsuo Kunii, Seiichi Tsuji, Motoyoshi Koyanagi
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Patent number: 6796604Abstract: To provide a front-end panel which is low-cost and looks attractive when incorporating a reinforcement, a front-end panel includes a first holding member provided along the reinforcement so as to hold one edge of the reinforcement, a second holding member provided along the reinforcement so as to hold the other edge of the reinforcement, and connecting bands for connecting the first holding member with the second holding member.Type: GrantFiled: July 9, 2003Date of Patent: September 28, 2004Assignees: GP Daikyo Corporation, Mazda Motor CorporationInventors: Tsuyoshi Igura, Kazuki Hatakeyama, Masanao Ogura, Seiichi Tsuji
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Publication number: 20040046422Abstract: To provide a front-end panel which is low-cost and looks attractive when incorporating a reinforcement, a front-end panel includes a first holding member provided along the reinforcement so as to hold one edge of the reinforcement, a second holding member provided along the reinforcement so as to hold the other edge of the reinforcement, and connecting bands for connecting the first holding member with the second holding member.Type: ApplicationFiled: July 9, 2003Publication date: March 11, 2004Inventors: Tsuyoshi Igura, Kazuki Hatakeyama, Masanao Ogura, Seiichi Tsuji
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Patent number: 5477938Abstract: A power plant support structure for supporting a power plant of a vehicle includes a center frame extending in a lengthwise direction of the car body. The center frame is connected, at its lengthwise ends, to front and rear cross members, disposed forward and rearward of the power plant and extending between front side frames. A front mount is secured to the center frame before the power plant and connects the power plant to the center frame. The center frame absorbs an impact exerted on the power plant during a front-end collision of the vehicle.Type: GrantFiled: October 5, 1994Date of Patent: December 26, 1995Assignee: Mazda Motor CorporationInventors: Seiichi Tsuji, Yoshikazu Ide, Mitsuru Fujinaka, Masayoshi Sannomiya
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Patent number: 5372216Abstract: A power plant support structure for supporting a power plant of a vehicle includes a center frame extending in a lengthwise direction of the car body. The center frame is connected, at its lengthwise ends, to front and rear cross members, disposed forward and rearward of the power plant and extending between front side frames. A front mount is secured to the center frame before the power plant and connects the power plant to the center frame. The center frame absorbs an impact exerted on the power plant during a front-end collision of the vehicle.Type: GrantFiled: April 1, 1994Date of Patent: December 13, 1994Assignee: Mazda Motor CorporationInventors: Seiichi Tsuji, Yoshikazu Ide, Mitsuru Fujinaka, Masayoshi Sannomiya
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Patent number: 5195607Abstract: A dual type exhaust system is used in an automobile having an internal combustion engine with transversely mounted front and rear rows of cylinders. Two exhaust pipe assemblies extend from the front and rear rows of cylinders, respectively, toward the back of the car body. The two assemblies are arranged side by side in a space formed in a floor panel. The exhaust pipe assemblies are, respectively, provided with catalytic converters offset in a lengthwise direction of the car body with respect to the space relative to each other so as to be arranged in a straight line in the space.Type: GrantFiled: November 19, 1990Date of Patent: March 23, 1993Assignee: Mazda Motor CorporationInventors: Yukiichiro Shimada, Nobuhiro Komatsu, Seiichi Tsuji, Satoshi Fujita, Hiroshi Nakatsuka, Hiromichi Kawamura, Makoto Shinhama
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Patent number: 4690432Abstract: A support of an automobile gauge cluster on a steering column for permitting a steering wheel to tilt up and down. The gauge cluster is provided for tilting motion in response to the tilting of the steering wheel and there is employed a bracket structure for the support of the steering column having a steering shaft rotatably extending therein. The bracket structure is rigidly connected with a portion of an automobile body structure and has a guide provided therein for guiding the tilting motion of the gauge cluster.Type: GrantFiled: October 23, 1985Date of Patent: September 1, 1987Assignee: Mazda Motor CorporationInventors: Toshinori Sakamoto, Isao Hirashima, Seiichi Tsuji
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Patent number: 4664595Abstract: A novel combination of sliding members operable both under dry (without lubrication) and wet (with lubrication) states, which comprises a first member made of a ceramic and a second member made of hard metal containing at least 75% by weight cemented carbide. This combination is useful as a bearing means in a pump of a vertical or inclined shaft type so as to permit actuation of the motor in the dry state and thereafter to continue operation of the pump with lubrication being provided by part of the liquid being pumped. In certain aspects, the ceramic member may be divided into a plurality of segments.Type: GrantFiled: September 14, 1984Date of Patent: May 12, 1987Assignee: Ebara CorporationInventors: Seiichi Tsuji, Kazuhiro Ogawara, Shikuo Koide, Shotaro Mizobuchi