Patents by Inventor Seiichi Uno
Seiichi Uno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11306172Abstract: An active energy ray-curable resin composition which is excellently adhesive to a base material, an undercoat agent which is for a metal thin film and includes the resin composition, and a formed material obtained using the undercoat agent for a metal thin film are provided. The active energy ray-curable resin composition includes, as essential components, an alkyd resin (A), an unsaturated bond-containing polymerizable compound (B), a phenolic compound (C) represented by the following structural formula (1) wherein R1 is a hydrogen atom or a hydrocarbon group), and a photopolymerization initiator (D) having a structural moiety represented by the following structural formula (2) wherein R3's are any of an aliphatic hydrocarbon group, an aryl group, an aralkyl group, an alkoxy group, a hydroxyl group and an amino group, wherein two or more of the R3's may form a ring structure.Type: GrantFiled: June 29, 2017Date of Patent: April 19, 2022Assignee: DIC CorporationInventors: Akio Umino, Seiichi Uno
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Patent number: 10781316Abstract: Provided are a coating material that is for undercoating for a thin inorganic film, has excellent adhesiveness to various base materials, and produces no appearance change or no peeling off even under high-temperature conditions, and an acrylic-modified alkyd resin as a raw material for such a coating material. The acrylic-modified alkyd resin includes a copolymer including as essential components: an alkyd resin (A) having an unsaturated bond in a molecular structure; and a polymerizable monomer (B) having an unsaturated bond in a molecular structure. Also provided are a curable composition, a coating material for undercoating for a thin inorganic film, and a molded body including an undercoat layer including the coating material for undercoating for a thin inorganic film.Type: GrantFiled: February 23, 2017Date of Patent: September 22, 2020Assignee: DIC CorporationInventors: Akio Umino, Seiichi Uno
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Publication number: 20190225730Abstract: An active energy ray-curable resin composition which is excellently adhesive to a base material, an undercoat agent which is for a metal thin film and includes the resin composition, and a formed material obtained using the undercoat agent for a metal thin film are provided. The active energy ray-curable resin composition includes, as essential components, an alkyd resin (A), an unsaturated bond-containing polymerizable compound (B), a phenolic compound (C) represented by the following structural formula (1) wherein R1 is a hydrogen atom or a hydrocarbon group), and a photopolymerization initiator (D) having a structural moiety represented by the following structural formula (2) wherein R3's are any of an aliphatic hydrocarbon group, an aryl group, an aralkyl group, an alkoxy group, a hydroxyl group and an amino group, wherein two or more of the R3's may form a ring structure.Type: ApplicationFiled: June 29, 2017Publication date: July 25, 2019Inventors: Akio Umino, Seiichi Uno
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Publication number: 20190055411Abstract: Provided are a coating material that is for undercoating for a thin inorganic film, has excellent adhesiveness to various base materials, and produces no appearance change or no peeling off even under high-temperature conditions, and an acrylic-modified alkyd resin as a raw material for such a coating material. The acrylic-modified alkyd resin includes a copolymer including as essential components: an alkyd resin (A) having an unsaturated bond in a molecular structure; and a polymerizable monomer (B) having an unsaturated bond in a molecular structure. Also provided are a curable composition, a coating material for undercoating for a thin inorganic film, and a molded body including an undercoat layer including the coating material for undercoating for a thin inorganic film.Type: ApplicationFiled: February 23, 2017Publication date: February 21, 2019Inventors: Akio Umino, Seiichi Uno
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Publication number: 20180155589Abstract: Provided are a polyester polyol which exhibits a high adhesion strength after being cured in a case of being used as a main agent for an adhesive for lamination, an excellent temporal stability in which the adhesion strength is not deteriorated in a heat and moisture resistance test, and an excellent appearance after being subjected to a lamination processing, a resin composition using the same, a two-part adhesive for lamination which contains the resin composition, and a back sheet for a solar cell. Specifically, as a main agent for the two-part adhesive for lamination, a polyester polyol which has a resin structure obtained by reacting a branched alkylene diol, a long-chain aliphatic dicarboxylic acid having 8 to 20 carbon atoms, and an aromatic tricarboxylic acid, and has a weight average molecular weight (Mw) of 10,000 to 100,000 and a molecular weight distribution (Mw/Mn) of 3.0 to 4.7 is used.Type: ApplicationFiled: January 16, 2018Publication date: June 7, 2018Inventors: Akio Umino, Seiichi Uno, Masami Hozumi, Kouji Akita, Tetsuya Toda
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Publication number: 20170179309Abstract: There are provided an adhesive for a solar-cell back sheet having an excellent curing rate and being capable of exhibiting excellent adhesive performance by short-term aging, and also a polyol composition used for the adhesive, a solar-cell back sheet using the adhesive, and a solar-cell module using the sheet. The adhesive for a solar-cell back sheet contains, as essential components, at least one hydroxyl group-containing resin (A) selected from a polyester polyurethane polyol (A1), a polyester polyol (A2), a hydroxyl group-containing (meth)acrylic resin (A3), and a hydroxyl group-containing fluorocarbon resin (A4), a polyisocyanate (B), and a cyclic amide compound (C).Type: ApplicationFiled: July 17, 2015Publication date: June 22, 2017Applicant: DIC CorporationInventors: Akio Umino, Kouji Akita, Seiichi Uno, Kousei Yamashita, Shou Miki
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Patent number: 9512330Abstract: Provided are an actinic-radiation-curable resin composition that has high storage stability and that combines high levels of ease of application and adhesion to various substrates and high levels of coating appearance and heat resistance after curing, an actinic-radiation-curable primer for metallization that contains such an actinic-radiation-curable resin composition, and a shaped article including an undercoat layer for metallization that has good adhesion to various substrates. Specifically, an actinic-radiation-curable resin composition is provided that contains an oil-modified alkyd resin and a (meth)acryloyl-containing compound. The oil-modified alkyd resin is prepared using two or more oils having iodine values of 100 or more and has an oil length of 30 to 60, a mass average molecular weight of 200,000 to 1,000,000, and a molecular weight distribution (Mw/Mn) of 50 or more.Type: GrantFiled: June 17, 2014Date of Patent: December 6, 2016Assignee: DIC CORPORATIONInventors: Akio Umino, Seiichi Uno
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Publication number: 20160233686Abstract: A power management unit includes a part that transmits a first information data related to a first device for creating, consuming, or accumulating first energy and a second information data related to a second device for creating, consuming, or accumulating second energy to a server. The power management unit further includes a part that receives control data for controlling the first and second devices from the server, and a part that transmits the control data to the first device and the second device. Further, a power management method transmits the first information data and the second information data from the power management unit to the server. Furthermore, the power management method transmits control data for controlling the first device and the second device from the server to the power management unit, and transmits the control data from the power management unit to the first device and the second device.Type: ApplicationFiled: September 22, 2014Publication date: August 11, 2016Inventors: JUNSHI YOSHIDA, TAKASHI NAKABAYASHI, KOICHI KUBOYA, YUJI OSUMI, HIROSHI SHIMOSATO, TAMAKI IWASAKI, SEIICHI UNO
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Publication number: 20160215184Abstract: Provided are a polyester polyol which exhibits a high adhesion strength after being cured in a case of being used as a main agent for an adhesive for lamination, an excellent temporal stability in which the adhesion strength is not deteriorated in a heat and moisture resistance test, and an excellent appearance after being subjected to a lamination processing, a resin composition using the same, a two-part adhesive for lamination which contains the resin composition, and a back sheet for a solar cell. Specifically, as a main agent for the two-part adhesive for lamination, a polyester polyol which has a resin structure obtained by reacting a branched alkylene diol, a long-chain aliphatic dicarboxylic acid having 8 to 20 carbon atoms, and an aromatic tricarboxylic acid, and has a weight average molecular weight (Mw) of 10,000 to 100,000 and a molecular weight distribution (Mw/Mn) of 3.0 to 4.7 is used.Type: ApplicationFiled: August 28, 2014Publication date: July 28, 2016Inventors: Akio Umino, Seiichi Uno, Masami Hozumi, Kouji Akita, Tetsuya Toda
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Publication number: 20160017177Abstract: Provided are an actinic-radiation-curable resin composition that has high storage stability and that combines high levels of ease of application and adhesion to various substrates and high levels of coating appearance and heat resistance after curing, an actinic-radiation-curable primer for metallization that contains such an actinic-radiation-curable resin composition, and a shaped article including an undercoat layer for metallization that has good adhesion to various substrates. Specifically, an actinic-radiation-curable resin composition is used that contains an oil-modified alkyd resin (A) and a (meth)acryloyl-containing compound (B). The oil-modified alkyd resin (A) is prepared using two or more oils (al) having iodine values of 100 or more and has an oil length of 30 to 70 and a mass average molecular weight of 30,000 to 200,000.Type: ApplicationFiled: July 29, 2014Publication date: January 21, 2016Applicant: DIC CorporationInventors: Akio UMINO, Seiichi UNO
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Publication number: 20150361298Abstract: Provided are an actinic-radiation-curable resin composition that has high storage stability and that combines high levels of ease of application and adhesion to various substrates and high levels of coating appearance and heat resistance after curing, an actinic-radiation-curable primer for metallization that contains such an actinic-radiation-curable resin composition, and a shaped article including an undercoat layer for metallization that has good adhesion to various substrates. Specifically, an actinic-radiation-curable resin composition is provided that contains an oil-modified alkyd resin and a (meth)acryloyl-containing compound. The oil-modified alkyd resin is prepared using two or more oils having iodine values of 100 or more and has an oil length of 30 to 60, a mass average molecular weight of 200,000 to 1,000,000, and a molecular weight distribution (Mw/Mn) of 50 or more.Type: ApplicationFiled: June 17, 2014Publication date: December 17, 2015Applicant: DIC CORPORATIONInventors: Akio Umino, Seiichi Uno
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Patent number: 8734943Abstract: Provided are a resin composition with high adhesion to substrates under hot and humid conditions, a two-part laminate adhesive containing the resin composition, and a laminated film and backsheet for solar cells including a layer of the adhesive. The resin composition contains, as essential components, a polyester polyurethane polyol (A) having a branched structure in a molecule thereof and having a weight average molecular weight (Mw) of 25,000 to 200,000 and a molecular weight distribution (Mw/Mn) of 2.5 to 25; a hydroxyl-containing epoxy resin (B) having a number average molecular weight (Mn) of 300 to 5,000; a hydroxyl-containing polycarbonate resin (C) having a number average molecular weight (Mn) of 300 to 3,000; and a polyisocyanate (D).Type: GrantFiled: April 5, 2012Date of Patent: May 27, 2014Assignee: DIC CorporationInventors: Akio Umino, Seiichi Uno, Noriyuki Ichinose, Kouji Akita, Masami Hozumi
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Publication number: 20140050919Abstract: Provided are a resin composition with high adhesion to substrates under hot and humid conditions, a two-part laminate adhesive containing the resin composition, and a laminated film and backsheet for solar cells including a layer of the adhesive. The resin composition contains, as essential components, a polyester polyurethane polyol (A) having a branched structure in a molecule thereof and having a weight average molecular weight (Mw) of 25,000 to 200,000 and a molecular weight distribution (Mw/Mn) of 2.5 to 25; a hydroxyl-containing epoxy resin (B) having a number average molecular weight (Mn) of 300 to 5,000; a hydroxyl-containing polycarbonate resin (C) having a number average molecular weight (Mn) of 300 to 3,000; and a polyisocyanate (D).Type: ApplicationFiled: April 5, 2012Publication date: February 20, 2014Applicant: DIC CORPORATIONInventors: Akio Umino, Seiichi Uno, Noriyuki Ichinose, Kouji Akita, Masami Hozumi
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Patent number: 6821703Abstract: A polyester resin particle dispersion material, in which the average particle size can be easily controlled within a broad range and is less likely to form irregular particles, and which is also suited for use in adhesives, is produced by dispersing a resin melt containing, as an essential component, a polyester resin (A) having a terminal structure in which an alkyl group having 4 to 20 carbon atoms or an alkenyl group having 4 to 20 carbon atoms is bonded to a carbon atom to which a carboxyl group is attached, or a carbon atom adjacent to this carbon atom, a portion or all of carboxyl groups in the polyester resin (A) being neutralized with a basic compound, in a heated aqueous medium in a melted state, and cooling the dispersed resin melt.Type: GrantFiled: October 24, 2001Date of Patent: November 23, 2004Assignee: Dainippon Ink and Chemicals, Inc.Inventors: Seiichi Uno, Nobuyoshi Shirai, Hideki Watanabe, Takayuki Kanematsu
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Publication number: 20020076639Abstract: A polyester resin particle dispersion material, in which the average particle size can be easily controlled within a broad range and is less likely to form irregular particles, and which is also suited for use in adhesives, is produced by dispersing a resin melt containing, as an essential component, a polyester resin (A) having a terminal structure in which an alkyl group having 4 to 20 carbon atoms or an alkenyl group having 4 to 20 carbon atoms is bonded to a carbon atom to which a carboxyl group is attached, or a carbon atom adjacent to this carbon atom, a portion or all of carboxyl groups in the polyester resin (A) being neutralized with a basic compound, in a heated aqueous medium in a melted state, and cooling the dispersed resin melt.Type: ApplicationFiled: October 24, 2001Publication date: June 20, 2002Applicant: Dainippon Ink and Chemicals, Inc.Inventors: Seiichi Uno, Nobuyoshi Shirai, Hideki Watanabe, Takayuki Kanematsu
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Patent number: 5843614Abstract: A novel manufacturing method for toner used in electrophotography employing no organic solvent is disclosed.Type: GrantFiled: March 20, 1997Date of Patent: December 1, 1998Assignee: Dainippon Ink and Chemicals, Inc.Inventors: Kinji Shinzo, Hideki Watanabe, Seiichi Uno, Munekazu Hayashi
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Patent number: 5691095Abstract: A toner containing at least a colorant and a resin, in which the resin is a polyester resin having a total acid radical content of 2 to 50 mg equivalents per 100 g and having a weight-average molecular weight of 2,000 to 100,000, and the toner particles are spherical and have an average particle diameter of 3 to 13 .mu.m. The toner is produced by a process comprising adding an aqueous medium to a dispersion of at least a colorant and an anionic self-emulsifiable resin in a water-miscible organic solvent to cause phase inversion to obtain an emulsion, and separating the produced particles from the aqueous medium, followed by drying, in which the anion self-emulsifiable resin is a polyester resin having a neutral salt structure, having a total acid radical content of 2 to 50 mg equivalents per 100 g and having a weight-average molecular weight of 2,000 to 100,000.Type: GrantFiled: December 7, 1995Date of Patent: November 25, 1997Assignee: Dainippon Ink and Chemicals, Inc.Inventors: Kinji Shinzo, Hideki Watanabe, Seiichi Uno, Nansei Tashiro, Minoru Nomura